Overview of Semiconductor Manufacturing
To stay current in this constant changing industry, a deep understanding is required of the new methods of
semiconductor manufacturing. After completing this course, the student will have a complete understanding of current
semiconductor manufacturing processes. The course covers device operation, crystal growth and various types of substrates.
How circuit design impacts fabrication, mask making, wafer processing, assembly, packaging and final test are also covered.
Additional topics include wafer processing steps such as mask generation, lithography, deposition (CVD, electro-plating, ALD and sputtering), oxidation,
diffusion, implant, RTP, etching and wafer probe.
Next Available Course Dates:
February 16-17, 2012 ~ San Jose, CA
April 30 - May 1, 2012 ~ Penang, Malaysia
May 3-4, 2012 ~ Singapore
May 23-24, 2012 ~ Munich, Germany
July 9-10, 2012 ~ San Francisco, CA
September 3-4, 2012 ~ Taipei, Taiwan
Register now for the next session!
WHAT THE COURSE COVERS: |
- DAY 1
- Introduction to Basic Electronics and Microelectronics Terms
- Define Process Nodes
- Device Physics and Operation
- Crystal Growth and Wafer Prep
- Circuit Design and Layout
- Mask Making
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- DAY 2
- Clean Rooms
- Lithographic Techniques
- Plasma and Wet Etch
- Ion Implantation
- Diffusion
- RTP
- CVD
- ALD
- Electro-Plating
- Sputtering
- CMP
- Wafer Sort
- Wire Bonding
- Bumping
- Packaging Technology
- 3D Stacking
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WHO SHOULD ATTEND? |
- Manufacturing Engineers
- Manufacturing Technicians
- Integration Engineers
- Process Engineers
- Marketing and Sales
- Equipment Suppliers
- Materials Suppliers
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- Equipment and Materials Suppliers involved in the microelectronics industry
who want a greater understanding of the microelectronic manufacturing and packaging processes.
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Materials included in this class include a course Manual filled with several color illustrations. |
We Exceed Your Expectations!"
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