Overview of Semiconductor Device and Assembly Manufacturing

In today’s competitive semiconductor environment, it is important to have an understanding of the integrated process flow from stating silicon through the completed package. To remain at the front of this rapid-moving industry an in-depth knowledge is required of the implementation of these technologies into the products and assembly lines.

The intent of this course is to provide an integrated overview of the complete semiconductor manufacturing process. We start with how single-crystal substrates are made and end with a packaged part. The background science needed for the information presented will be provided. The course begins with an overview of basic materials-related concepts used in microelectronics processing. We will touch on how a transistor works with respect to the physical layout of Bipolar and MOSFET transistors. This is followed by a description of process steps required to make a transistor and an integrated circuit. Process steps such as photolithography, deposition (chemical vapor and sputtering), oxidation, implant, and etch along with current packaging technology will be covered. The latest BGA and wire-bond packaging process flows will be covered. The focus is on how each process step integrates with the others to form an integrated circuit on silicon and to package the die. After completing this class the student will be able to describe the purpose of all fab and assembly process steps as well have an understanding of how the process steps integrate together to form the completed product.