- Introduction
- Terminology, Surfaces, Types of Surfaces
- The principles of AES
- Production of Auger electrons, peak labeling, ionization cross-sections, handbooks, books, backscattering, surface sensitivity, information depth, sample handling.
- Qualitative Analysis
- Direct and derivative spectra, identification of elements, energy resolution, peak widths, chemical effects, plasmons, cross transitions, ion-excited Auger transitions.
- Quantitative Analysis
- Auger Intensities, sensitivity factors, detection limit, lineshapes, analyzer transmission, electron multiplier effects, matrix factors, average matrix sensitivity factors, backscattering, angle of incidence and emission, standard spectra, diffraction.
- Artifacts
- Ionization loss peaks, electron beam damage.
- Instrumentation
- Field emission electron source, spatial resolution (beam), signal-to-noise, beam damage, cylindrical mirror analyzer (CMA), hemispherical type analyzer (HSA),
modes of operation, electron detection, pulse counting, other electron sources, vacuum system, samples, other types of analyzers, scattering in analyzers, energy scale calibration.
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- Imaging and Spatial Resolution
- Scanning electron microscopy, acceptance area, locating regions of interest, corrections for topography and backscattering, beam energy,
spatial resolution (analysis), comparison of analyzers, Electron Energy Loss (EELS) imaging, ratioed scatter diagrams, line scans, image registration.
- Data Acquisition, Processing and Depth Profiling
- Spectrum subtraction, sputtering, crater edge profiling, angle resolved AES, factor analysis, linear least squares fitting, sample rotation, mechanical methods.
- Insulating Samples
- Charge control methods, effects on images and spectra, use of low energy ion beam.
- Applications
- Nano-analysis of spheres, particles, via holes, insulators, sputter depth profiles of nanolayers
- Instrument selection and summary
- Factors to consider, general summary.
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