Introduction to Chip and Wire Assembly in Microelectronic Packaging

This course serves as an introduction and primer in Chip & Wire assembly for those new to the technology, have a need to know, or are just curious. It will also serve as an overview, a review, or a refresher course, providing an update on all aspects of Die Bonding and Wire Bonding processes for those currently involved either directly or indirectly with packaging and assembly.

Next Available Course Dates:


August 5, 2008 ~ Dallas, TX
Register now for the next session!

This and all other courses offered as On Site Training


WHAT THE COURSE COVERS:
  • Introduction
  • C&W in Electronic Manufacturing and First Level Interconnects

  • The C&W Assembly Process
  • Basic Requirements
  • Critical Factors
  • Cleaning
  • Die Bonding
  • Eutectic/Adhesive

  • Wire Bonding
  • High Yield Wire Bonding
  • Bondable Metals
  • Plated Metals
  • Insuring Bondability

  • The Bonding Wire
  • Au, Al, Cu

  • Bonding Wire Methods
  • Thermosonic/Ultrasonic/Thermosonic
  • The Automatic Wire Bonder
  • Responding to New Packaging and Assembly Technologies
  • Evaluating Wire Bonding
  • Wire Pull Testing
  • Ball Shear
  • Destructive Pull Testing
  • Non-Destructive Pull Testing
  • Critiquing Test Results - Pull Strengths and Failure Modes

  • Wire Bonding for COB Applications
  • Organic substrates
  • Wire Bonding Problems
  • Successful Wire Bonding

  • Alternatives: Tape Automated Bonding, Flip Chip
  • Wafer Bumping
  • Device Bumping
  • Tape Manufacturing
  • TAB Bonding/Assembly
  • Flip Chip Assembly

  • In Summary
  • Semiconductor, Hybrids and COB assembly -
    “The Name of the Game”

WHO SHOULD ATTEND?
  • Manufacturing Engineers and Technicians
  • Supervisory personnel including Production and Quality Control
  • Supervisory personnel in Program and Operations Management
  • Supervisory personnel in Planning and Support
This course includes a Chip and Wire Assembly manual with color illustrations.

"We Exceed Your Expectations!"
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