Introduction to Chip and Wire Assembly in Microelectronic Packaging

This course serves as an introduction and primer in Chip & Wire assembly for those new to the technology, have a need to know, or are just curious. It will also serve as an overview, a review, or a refresher course, providing an update on all aspects of Die Bonding and Wire Bonding processes for those currently involved either directly or indirectly with packaging and assembly.

This and all other courses offered as On Site Training


WHAT THE COURSE COVERS:
  • Introduction
  • Review of all aspects of die bonding and wire bonding processes in electronic manufacturing and first level Interconnects
  • Wire bonding packaging
  • Wire metals such as Au, Al, and Cu
  • Wire bonding methods: thermosonic/ ultrasonic/ thermo compression
  • Equipment Used
  • Package and assembly technologies
  • Wire bonding quality
  • Wire pull test
  • Ball shear test
  • Non-destructive pull testing
  • Critiquing test results
  • Pull strengths and failure modes
  • Wire bonding for COB applications
  • Organic substrates
  • Wire bonding problems
  • Tape automated bonding
  • Flip Chip
  • Wafer bumping
  • Device bumping
  • TAB bonding/assembly
  • Flip chip assembly

WHO SHOULD ATTEND?
  • Manufacturing Engineers
  • Technicians
  • Supervisory personnel including Production and Quality Control
  • Program and Operations Management
  • Planning and Support

This course includes a Chip and Wire Assembly manual with color illustrations.

This course includes a manual filled with color illustrations for each student.


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