- Introduction
- Review of all aspects of die bonding and wire bonding processes in electronic manufacturing and first level Interconnects
- Wire bonding packaging
- Wire metals such as Au, Al, and Cu
- Wire bonding methods: thermosonic/ ultrasonic/ thermo compression
- Equipment Used
- Package and assembly technologies
- Wire bonding quality
- Wire pull test
- Ball shear test
- Non-destructive pull testing
- Critiquing test results
- Pull strengths and failure modes
- Wire bonding for COB applications
- Organic substrates
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- Wire bonding problems
- Tape automated bonding
- Flip Chip
- Wafer bumping
- Device bumping
- TAB bonding/assembly
- Flip chip assembly
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