Fundamentals of Chemical Mechanical Planarization

This course is designed to provide a sound foundation in the fundamentals of chemical mechanical planarization (CMP) used today in integrated circuit fabrication. Topics include CMP overview, CMP tools, CMP consumables, fundamentals of process control, dielectric CMP, CMP of conducting materials and post CMP cleaning. This course gives students in the industry an in-depth understanding of CMP issues and fabrication concepts. This course strives to offer industry specialists a broader understanding on how their job, service, or product affects the CMP process.

Currently Scheduled Open Course Dates:

December 12, 2008 ~ Dallas, TX

Register now for the next session!

This and all other courses are available for On Site Training

WHAT THE COURSE COVERS:

  • CMP Overview
  • CMP Definition
  • Classical CMP Equipment
  • CMP in the Fabrication of Integrated Circuits
  • Formation of Interconnect Structures
  • Goals in Planarization
  • Enhanced Step Coverage
  • Planarization Terms
  • CMP Advantages
  • CMP Quality Issues
  • Step Height Reduction
  • Overall Surface Quality

  • CMP Applications
  • Interlevel Dielectric Planarization
  • Advantages of HDPCVD
  • LOCOS and Shallow Trench Isolation (STI)
  • Tunstun Plug Formation
  • Dual Damascene Process
  • Trench Capacitors

  • CMP Equipment
  • Planten
  • Novellus (formerly Speedfam IPEC) Wafer Carrier
  • New Generation Wafer Carrier
  • Slurry Delivery System
  • Pad Conditioning Arm
  • Pad Conditioners
  • Conditioner Disks
  • CMP Sensors and Metrology
  • Optical Techniques
  • Motor Current Based Techniques
  • Motor Current Endpoint Detection
  • Optima Model 9325
  • Hall Effect Current Sensor
  • CMP Tool Type
  • Ebara CMP Tool
  • Orbital Polishing
  • Lam Teres Polisher
  • Layout of Nikon CMP (NPS3301)

  • CMP Consumables
  • Pad Structure and Properties
  • Pad Hardness
  • Pad Specific Gravity
  • Pad Surface Roughness
  • Fixed Abrasive Pads
  • Slurries for CMP
  • Particles
  • Fumed Silica
  • Colloidal Silica
  • Solution
  • Buffers
  • Etchants
  • Oxidants
  • Slurry Properties

  • Dielectric CMP
  • Low-k Materials
  • Flourinated Silicon Dioxide
  • CMP of Conducting Materials
  • Metal Properties

  • Resistivity
  • Film Stress
  • Hardness
  • CMP Mechanism
  • Abrasive Feel Polishing (AFP)
  • Dishing Depth after Over-polishing

  • Fundamentals of Process Control
  • Process Parameters
  • Down Force Velocity
  • Effect of Slurry pH
  • Slurry pH and the Zeta Potential
  • Slurry Transport
  • Temperature
  • Doping Effects
  • Stress
  • CMP Defects
  • "Bright Field" Core Technologies
  • "E-Beam Inspection" Core Technology
  • Defect Mechanism in Cu Interconnect
  • CMP Defects

  • Post CMP Cleaning
  • Post Polish Buffing
  • Particle Removal
  • Brush Cleaning or Double Sided Scrubbing
  • Cleaning Methods
  • Megasonic Cleaning
  • Post Copper CMP - Chemicals
  • Metallic Contamination after CMP

WHO SHOULD ATTEND?

  • Employees who are new to the industry or those who work in industry and want a more in-depth knowledge of a specialty area will benefit by broading their semiconductor CMP knowledge.
  • Production Personnel
  • Process Engineering
  • Field Service
  • Process Operators
  • R&M Technicians
  • Equipment Engineers
  • Quality and Product Engineers
  • Engineering
  • Tool and Material Vendors in Marketing and Sales
This course includes a CMP manual with numerous graphic color illustrations, a Periodic Table and a Chemical Symbol Handout.

"We Exceed Your Expectations!"
Return to Home Page
Return to Course Schedule