Advanced Copper Interconnect Technology

This tutorial will provide an overview of copper interconnect technology. We will review the basic materials and processes used in Cu interconnect fabrication for the 130 nm through 32 nm nodes, including dielectric materials, patterning, metallization, CMP, packaging, and reliability.

We offer this and all courses as On Site Training

WHAT THE COURSE COVERS:
  • Introduction
  • Scaling
  • RC Delay
  • Power


  • Dielectric Material Processing
  • What is Dielectric Constant?
  • Types of Dielectrics; Organic vs Inorganic
  • Deposition: Plasma CVD vs Spin-on
  • Barrier Layers: SiN, SiC


  • Dielectric Material Properties
  • Electrical Properties
  • Mechanical Properties
  • Thermal Properties
  • Thermal and Chemical Stability
  • Process Integration of Copper Interconnects
  • Integration Options
  • Lithography and RIE
  • Resist Strip and Cleans
  • Metal Deposition: Liner and Seed, Plating
  • Packaging; Wirebond vs. Flipchip
  • CMP


  • Reliability of Cu Interconnects
  • Electromigration
  • Stress Migration
  • TDDB
  • Package Stress Evaluation; pull test, shear test, humidity test, thermal cycle


WHO SHOULD ATTEND?
  • Manufacturing Engineers and Technicians
  • Supervisory personnel including Production and Quality Control
  • Supervisory personnel in Program and Operations Management
  • Supervisory personnel in Planning and Support
  • Anyone with a technical background who needs to gain an understanding of the processes involved in dual damascene sequence while fabricating Cu interconnects.

"We Exceed Your Expectations!"

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