Deep Sub Micron CMOS Process Integration

This course offers detailed instruction on the physics behind the operation of a modern integrated circuit, and the processing technologies required to make them.  Also covered is the process integration techniques from design thru manufacturing sub nanoscale devices. Participants learn basic but powerful aspects about the semiconductor industry. This skill-building series is divided into these segments:

1. Basic Device Operation: Participants learn the fundamentals of transistor operation. They learn why CMOS (Complimentary Metal Oxide Semiconductor) devices dominate the industry today.
2. Fabrication Technologies: Participants learn the fundamental manufacturing technologies that are used to make modern integrated circuits. They learn the typical CMOS process flows used in integrated circuit fabrication.
3. Current Issues in Process Integration: Participants learn how device operation is increasingly constrained by three parameters. They also learn about the impact of using new materials in the fabrication process and how those materials may create problems for the manufacturers in the future.
4. An Overview of Issues Related to Process Integration: Participants learn about the image of new materials, yield, reliability and scaling on technology and process integration. They receive an overview of the major reliability mechanisms that affect silicon ICs today.

Course Objectives
1. The seminar will provide participants with an in-depth understanding of the semiconductor industry and its technical issues.
2. Participants will understand the basic concepts behind transistor operation and performance.
3. The seminar will identify the key issues related to the continued growth of the semiconductor industry.
4. The seminar offers a wide variety of sample problems that participants work to help them gain knowledge of the fundamentals of device operation and manufacturing.
5. Participants will be able to identify basic and advanced technology features on semiconductor devices. This includes features like hi-k dielectrics, strained silicon, copper, and low-k dielectrics.
6. Participants will understand how reliability, power consumption and device performance are interrelated.
7. Participants will be able to make decisions about how to construct and evaluate new CMOS technologies.

This and all other courses are available for On Site Training

WHAT THE COURSE COVERS:
  • Introduction
  • Conventional CMOS
  • Key Components and Parameters
  • Process Overview and Integration Issues
  • Scaling and Limitations
  • Mobility Enhancement Techniques
  • Strained Silicon
  • Crystal Orientation
  • Gate Stacks, High-k Dielectrics
  • Gate Conductor Materials and Properties
  • High-k Materials and Properties
  • Gate Stack Integration
  • Options for Source-Drain, Extensions
  • Elevated Source / Drain
  • Co-Implantation of Inactive Species
  • Schottky-Barrier Source-Drain
  • Three-Dimensional Structures
  • FinFETs, Multi-Gates
  • Interconnects
  • Aluminum Interconnects, Issues
  • Copper Interconnects, Issues
  • Low-k Dielectrics
  • CMOS Reliability Considerations
  • Electrostatic Discharge
  • Electromigration and Stress Migration
  • Soft Errors, Plasma Damage
  • Dielectric Reliability
  • Bias Temperature Instabilities
  • Hot Carrier Reliability
  • Burn-In
  • Yield Considerations
  • Yield Detractors
  • Models
  • Monitors

WHO SHOULD ATTEND?
  • Any one working in the semiconductor industry who has need to understand process integration of nano scale devices.

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