Defect Isolation of Microelectronic Die
This course covers defect isolation techniques, the root cause of failure may be determined at the chip level. The one day course offered for reliability engineers, technical personnel and technical managers interested in understanding the role of defects at the microelectronic chip level. The techniques for isolating physical defects will be taught. The students of this course will be able to select and use techniques for isolating the defects that are causing failure.
Next Available Course Dates:
October 16, 2008 ~ Dallas, TX
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for the next session!
| WHAT THE COURSE COVERS: |
- External Inspection Procedures
- Electrical Characterization, Curve Tracer Analysis
- X-ray Inspection
- Scanning Acoustic Analysis
- Optical Microscopy Examination
- De-Capsulation: Chemically and Mechanically
- Scanning Electron Microscopy
- Light Emission Microscopy
- Voltage Contrast Imaging
- Infra Red Imaging Microscopy
- Focused Ion Beam (FIB)
- Radiographic Examination
- Hermeticity Examination
- SEM Imaging with Energy Dispersive X ray
- Auger Electron Spectroscopy
- Focused Ion Beam
- Chemical De-layering and Cross-Sectioning
- Particle Impact Noise Detection
- Electrical Measurements
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| WHO SHOULD ATTEND? |
- Reliability Engineers
- Technical personnel and technical managers interested in understanding the role of defects at the microelectronic chip level
- Engineering personnel needing an understanding of the methods used to detect and isolate faults that occur during the processing of semiconductor die.
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This is a one day course and each student will get a comprehensive
set of course notes.
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