Defect Isolation of Microelectronic Packaging

The course allows the student to learn the methods of defect isolation in single chip packaging, multichip modules as well as optical interconnects. The methods the course covers include: (1) Optical microscopy inspection, (2) Scanning Electron Microscopy Inspection, (3) Microanalysis, (4) X-ray Inspection, and (5) Chemical and Mechanical Analysis.

Defect isolation in the base materials is a critical aspect and is covered during the course. These techniques allow for laminate evaluation: surface appearance, peel strength, solder resistance, thermal analysis, dielectric analysis. Mechanical property evaluation include dielectric analysis, flexural strength, coefficient of thermal expansion.

Next Available Course Dates:

October 17, 2008 ~ Dallas, TX

Register now for the next session!

We offer this and all courses as On Site Training


WHAT THE COURSE COVERS:
    The course is outlined by the type of semiconductor packaging technology:
  • Single-Chip Packaging
  • DIP, LCCCs, PQFP, PGA, Direct Chip Attach
  • Package Density Characterization
  • Fault Isolation at Die Attach, Encapsulation Surfaces and Interconnect Interfaces
  • Multichip Packages
  • Isolation of Defects via Testing with Eenvironmental SEM
  • Isolation of Faults at Substrates (organic substrates, inorganic substrates)
  • Isolation of Faults at vias and Solder Surfaces
  • Defect Isolated via Precise Sectioning
  • Advanced Techniques for Defect Isolation
  • Electron Spin Resonance
  • X Ray Techniques
  • Fourier Transform Infra-Red Techniques
  • Micro Analysis Techniques


WHO SHOULD ATTEND?
  • Engineers, Scientists and Technicians engaged in Failure Aanalysis, Package Development, Design, Assembly, Manufacturing, Reliability, Quality, and Testing of Electronic Products. 
  • Students and academia involved with microelectronic studies.
  • Intellectual legal staff
  • Marketing and Sales
  • Others who require an understanding of the packaging technology

This is a one day course and each student will get a comprehensive set of course notes.



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