- Intro
- Why Test?
- Causes of Failures
- How to Test
- Stress, Strength, and Failure of Materials
- Material Properties
- Causes of Strength Deterioration
- Design against Fatigue
- Wear Mechanisms
- Wear Reduction
- Corrosion
- Other Mechanical Failure Mechanisms
- Material Selection for Reliability/Durability
- Stress, Strength, and Failure of Electronics
- Stress Effects
- Temperature Effects on Reliability
- Semiconductor Device Technologies
- Microcircuit Mounting and Connection
- Semiconductor Device Failure Mechanisms
- Passive Device Failure Mechanisms
- Solder
- Insulation
- EMI
- Electrical Overstress (EOS)
- Electrostatic Discharge (ESD)
- Variation and Reliability
- Different Types of Distributions
- Distributed Load and Strength
- Design Analysis
- Multiple variations/Design of Experiments
- Confidence and risk
- Statistical, scientific, and engineering confidence
- Measures of reliability
- Patterns of failure
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- Development Test Principles
- Fundamental Principle of Test Development
- Limits
- Environments
- Accelerated Stress Test
- Highly Accelerated Life Test (HALT)
- Accelerated Test vs. DOE
- Electronics Test
- Circuit Test Principles: Analog
- Circuit Test Principles: Digital
- Manual Test Equipment
- Automated Test Equipment (ATE)
- Test Capability
- Design for Test (DfT)
- Layout for ICT
- Built-in Test (BIT)
- EMI/EMC Test
- Test Control and Data Acquisition
- IC Test
- Software
- Hardware/Software Reliability Differences
- Software Reliability
- Error Reduction
- Fault Tolerance
- Languages
- Software Testing
- Documentation
- Software Reliability Prediction and Measurement
- Manufacturing Test
- Test in Manufacturing
- Manufacturing Test Principles
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- Test Capability
- Manufacturing Test Economics
- Stress Screening
- HASS
- Electronics Manufacturing Faults
- Fault Proportions and Coverage
- Assembly Test
- Burn-In (ESS)
- Integrating Stress Screening
- Test in Service
- Test schedule (continuous, operating cycles, calendar time)
- BIT/BIST
- No Fault Found
- Reliability Centered Maintenance (RCM) Objectives
- Maintenance Categories
- Stress Screens for Repairs
- Calibration
- Data Collection and Analysis
- FRACAS
- Failure review board
- Different types of databases
- Linking databases across divisions/suppliers
- Managing Tests
- Test Procedures
- Developing a Test Program
- Testing Purchased Items
- In-House vs. External Facilities
- Project Test Plan
- Manufacturing Test Plan
- Management Issues
- Future of Test
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