Design for Reliability, Reliability Testing and Statistical Analysis, and Failure Analysis of Lead Free Solder
Joints
Solders have given us a remarkable flexibility to interconnect electronics components. The unique properties of solders have facilitated Printed Circuit Assembly (PCA)
choices that have fueled creative advance packaging developments, e.g., solder-bumped flip-chip technology, ball grid array (BGA) technology, chip scale
packages (CSP) technology, and wafer-level CSP (WLCSP) technology. For these technologies, solder is the electrical and mechanical “glue” and their solder joint
reliability is one of the most critical issues in the development of these technologies.
In this course, participants will learn the principles of design for reliability (DFR), reliability testing and data analysis, failure analysis, and lead-free soldering
and manufacturing. Emphasis is placed on the solder-joint reliability of solder-bumped flip-chip assemblies, solder-balled BGA assemblies, solder-bumped CSP
and WLCSP assemblies, and fine-pitch assemblies under thermal fatigue, isothermal fatigue, mechanical bending and shearing, and shock (drop) & vibration conditions. Also,
up-to-date lead-free solder-joint reliability data of high-density PCA are presented.
WHAT THE COURSE COVERS: |
- Intro to Test
- Introduction
- RoHS Directives
- Lead-Free Soldering and Inspections
- Reliability Engineering
- Definition of Reliability
- Life Distributions
- Reliability Function
- Failure Rate
- Mean Time to Failure (MTTF)
- Examples
- Design for Reliability (DFR) of Lead-Free Solder Joints
- Environmental Stress Factors
- Failure Modes: Overload vs. Fatigue
- Material Properties (TCE, Young’s Modulus, Creep)
- Isothermal Thermal Fatigue Data of Flip Chip and PBGA>
- Effects of X on IMC and Cu Consumption of SnAgCuX Joints
- Examples, e.g., DFR of PBGA and WLCSP Solder Joints
- Reliability Testing and Statistical Analysis of Lead-Free Solder Joints
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- Qualification Tests vs. Reliability Tests
- Thermal Cycling Test
- Thermal Shock Test
- Mechanical Bending Test
- Mechanical Shearing Test
- Mechanical Pull Test
- Shock and Vibration Test
- Weibull Life Distribution
- Order Statistics (Ranking)
- Parameter Estimation for Life Distributions
- Weibull Slope Errors and True Weibull Slopes
- True Characteristic Life
- True Mean Life
- Comparison of the Life of Two different sets of Solder Joints
- Accelerated Life Testing
- Acceleration Factors
- Acceleration Models
- Examples, e.g., Reliability Tests of PBGA and WLCSP Assemblies
- Summary
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WHO SHOULD ATTEND? |
- Managers and Engineers in the Electronics Industry
- R & D Personnel
- Scientists
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"We Exceed Your Expectations!"
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