Lead Free Solder Impacts of EU RoHS and China RoHS on IC Packaging and PCB Assembly

Since February 13, 2003, lead-free has been a law in EU (European Union). The implementation date is July 1, 2006. That means, after July 1st, all the electronic products (except those with exemptions) cannot be put into the market of EU. At the time being, China is considering to have her own lead-free law. Recently, packages such as PBGA (plastic ball grid array), CSP (chip scale package), and especially WLCSP (wafer level chip scale package) have been very popular for consumer, computer, communication, and mobile products. Most of these packages use solders as their interconnects, thus they are affected by the lead-free regulations!

In this course, some critical issues of lead-free soldering (such as cost, regulations, definitions, design, materials, forward- and backward-process incompatibility, inspections, tests, and reliability of components, PCBs, tin whiskers, and solder joints) will be presented. Also, Some critical issues of the most popular SMT packages such as PBGA, CSP, and WLCSP will be discussed. The impacts of lead-free on these SMT packages are examined.

Most of the materials are based on the instructor’s recently published textbooks, “Solder Joint Reliability of BGA, CSP, Flip Chip, and Fine Pitch SMT Assemblies”, “Electronics Packaging”, “Chip Scale Packages”, “Low-Cost Flip Chip Technologies for DCA, WLCSP, and PBGA Assemblies”, “Microvias for Low-Cost High-Density Interconnects”, and “Electronics Manufacturing with Lead-Free, Halogen-Free, and Conductive Adhesive Materials”. Each participant will receive a comprehensive set of handout notes.

This and all other courses are available for On Site Training


WHAT THE COURSE COVERS:
  • Introduction
  • EU RoHS and Technical Adaptation Committee
  • China RoHS and Standard Committee
  • Key Difference between EU RoHS and China RoHS
  • China’s Lead-Free Solder Material Standards
  • Test/Measurement Methods for RoHS Compliant Products
  • Design, Materials, Process, and Manufacturing of Lead-Free Products
  • How to Select Lead-Free Component Surface Finishes
  • Tin-Whisker Issues and the Methods to Reduce Them
  • How to Test Tin Whisker
  • How to Qualify Lead-Free Components
  • PCB/Substrate Surface Finishes for Lead-Free
  • How to Qualify Lead-Free PCBs
  • Lead-Free Transition Issues
  • How to Develop Lead-Free Reflow Profiles for your Products
  • Effects of Lead-Free Soldering on Components
  • Effects of Lead-Free Soldering on PCBs
  • Visual Inspections
  • X-ray Inspections
  • AOI
  • Rework of Lead-Free Assemblies
  • Lead-Free Solder Joint Reliability
  • Design for Reliability of Lead-Free Solder Joints
  • Reliability Test of Lead-Free Solder Joints
  • Failure Analysis of Lead-Free Solder Joints
  • Flip-Chip WLCSP with Lead-Free Solders
  • Solder Bumps
  • Wafer Bumping
  • Solder-bumped Flip Chip Assembly on PCB
  • Underfill Encapsulants and How to Select Them
  • Reliability of Solder-Bumped Flip Chip on PCBs
  • Reliability of WLCSP on Microvia Build-Up PCBs
  • Summary and Open Discussions

WHAT YOU WILL LEARN from this COURSE:
  • Understand EU RoHS and China RoHS
  • Understand all important aspects and critical issues of SMT lead-free soldering
  • Have a head-start of SMT lead-free soldering for your green products
  • Understand all important aspects of SMT BGA, WLCSP, and flip chip technologies
  • Understand the key problems of the design, materials, and process of lead-free products
  • Identify key parameters that impact the lead-free solder joint reliability of your products
  • Avoid potential reliability problems due to lead-free soldering of your high-density products
  • Choose a cost-effective design of your high-density electronic assemblies
  • Establish a high-yield lead-free SMT manufacturing process
  • Understand all important aspects of flip chip technologies

WHO SHOULD ATTEND?
  • If you are involved with any aspect of the electronics industry, you should attend this course.
  • The content is recommended for component, packaging, design, material, process, equipment, reliability, product assurance, quality control, manufacturing, vendor, marketing, and sales engineers and managers. It is equally suited for R&D engineers and scientists.

Most of the materials are based on the instuctors recently published textbooks, "Solder Joint Reliability of BGA, CSP, Flip Chip and Fine Pitch SMT Assemblies", "Electronics Packaging", "Chip Scale Packages", "Low-Cost Flip Chip Technologies for DCA, WLCSP and PBGA Assemblies", "Electronics Manufacturing with Lead Free, Halogen Free and Conductive Adhesive Materials". Each student will get a comprehensive set of course notes.


INSTRUCTOR:

Dr. John Lau earned his Ph.D. degree in Theoretical and Applied Mechanics (University of Illinois) and 3 master degrees in Structural Engineering (University of British Columbia), Engineering Physics (University of Wisconsin), and Management Science (Fairleigh Dickinson University). John is the Lead-Free Technical Program Manager of Agilent Technologies, Inc.

With more than 30 years of R&D and manufacturing experience in the electronics, photonics, and automobile industries, he has authored and co-authored over 250 peer-reviewed technical publications, authored more than 100 book chapters, and given over 250 workshops and invited presentations. He has been teaching electronics and optoelectronic packaging courses for IEEE, ASME, IPC, SMTA, ASM, NEPCON, and APEX since 1986. The engineers/managers from many prestigious companies had taken his courses with exceptional results and satisfactions.

John received many awards from ASME (American Society of Mechanical Engineers), IEEE (Institute of Electrical and Electronics Engineers) and other Societies for best Transactions and Proceedings papers and outstanding technical achievements. He is one of the distinguish lecturers of ASME and IEEE. He is also one of the Fellows of ASME and IEEE.


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