Methods for understanding failure mechanisms of semiconductor devices will be taught. The methods of the physics of failure of devices, and device materials at the die and “chip” level, are reviewed. The main emphasis will be given to basic degradation mechanisms through understanding the physics, chemistry and mechanics of such mechanisms. Mechanical failures are introduced through understanding fatigue, creep and yielding in die materials, and devices. Physical or chemical related failures are introduced through a basic understanding of physical mechanisms such as diffusion, electromigration, defects and defect migration, surface trapping mechanisms, charge creation and migration. Failure mechanisms observed in real devices will also be presented. Problems related to device manufacturing, and microelectronics die accelerated testing will be analyzed.