Low-Cost Flip Chip, WLCSP & Lead Free Technologies

The major trend in electronics industry today is to make products more personal by making them smarter, lighter, smaller, thinner, shorter, and faster, while at the same time making them more friendly, functional, powerful, reliable, and less expensive. The last few years witnessed an explosive growth in the research and development efforts devoted to solder bumped flip chip, direct chip attach (DCA), wafer level chip scale package (WLCSP), plastic ball grid array (PBGA), and Microvia as a direct result of the rapid growth of surface mount technology and miniaturization. Many major equipment makers and leading electronic companies are now gearing up for these emerging and advanced packaging technologies. To remain in the forefront of this fast-moving industry, requires in-depth knowledge and understanding and technical know-how of the implementation of these technologies into the products and assembly lines. This one-day course will discuss vital issues such as the economic, design, material, process, equipment, quality, and reliability relating specifically to this growing industry and address key aspects and questions on microvia buildup high density interconnects, WLCSP, DCA, FC-PBGA, and lead free solder bumped flip chip packaging and assembly techniques. After completing this tutorial, you will be able to choose a cost-effective packaging design and high-yield manufacturing process.