This course provides an overview of IC packaging and assembly, the current
trends and the available options highlighting technical issues and reliability
concerns wherever applicable. This course addresses the impact of both the
Integrated Circuit, and End product requirements for "smaller, better,
cheaper", on packaging, assembly, and substrate interconnects. It focuses
on packaging trends, namely the Ball Grid Array, (BGA) and the Chip Scale
Package (CSP), and alternative formats, Multichip Modules (MCM), Chip On Board
(COB) and 3-D initiatives at both the chip and package levels. Assembly options
available for attachment of the IC in each case will be discussed with major
emphasis on Flip Chip. Throughout the course the technical issues will be
emphasized and reliability concerns addressed where appropriate.
This course is designed to serve as an introduction, a review, and an update
of IC packaging trends and assembly options. It is therefore directed to a
wide range of individuals directly or indirectly involved (or only interested)
in electronic manufacturing and the associated technologies. It is ideal for
the entry level through experienced engineer/technician in product engineering/manufacturing,
as well as support personnel in product assurance and procurement. It provides
an excellent technology base for individuals in sales and marketing, program
office and those responsible for strategic planning and technology implementation.