This course addresses IC packaging, assembly, and package/substrate interconnections. It stresses the impact of the IC and end product requirements,
i.e., “smaller, better, cheaper” and their influence on the manufacturing processes. Topics include area packaging - ball grid arrays and chip scale packages, stacked die
packages, and the assembly technologies – Chip & Wire, Tape Automated Bonding, and Flip Chip package types. High Density Interconnect substrate manufacturing
technologies including HDI Printed wiring boards are also discussed, as is emerging technologies namely, 3-D or through silicon via, and packages and packaging reliability
issues.
The objectives of this course are to provide the students with a basic overview of the technologies, the materials, and processes involved in the packaging and assembly of the
Integrated Circuit. This will allow them to make knowledge based decisions regarding implementation of appropriate technologies for their particular application. Students will
also learn about reliability issues associated with assembly and packaging.