All airfare and associated travel costs are paid for by Pinnacle Training International Seminars. All courses are one (1) day unless otherwise stated. |
| Advanced Copper Interconnect Technology with a minimum of 16 attendees. Outside of US $1045 with a minimum of 16 attendees. This is a 2 day course. |
| Advanced Wet Etch and Cleaning with a minimum of 16 attendees. Outside of US $595 with a minimum of 20 attendees. |
| Advanced Lithography with a minimum of 18 attendees. Outside of US $695 with a minimum of 20 attendees. |
| Advanced Processes for 193nm Immersion Lithography with a minimum of 12 attendees. Outside of US $1095 with a minimum of 14 attendees. This is a 2 day course. |
| Applied Data Analysis with a minimum of 12 attendees. Outside of US $1045 with a minimum of 14 attendees. This is a 2 day course. |
| Auger Electron Spectroscopy (AES) with a minimum of 12 attendees. Outside of US $1045 with a minimum of 14 attendees. This is a 2 day course. |
| Biomimetics - Biologically Inspired Technology with a minimum of 20 attendees. |
| CMOS Analog Design with a minimum of 14 attendees. Outside of US $1545 with a minimum of 16 attendees. This is a 3 day course. |
| Complete Overview of Electrostatic Discharge with a minimum of 16 attendees. Outside of US $545 with a minimum of 20 attendees. |
| Deep Sub Micron CMOS Process Integration with a minimum of 14 attendees. Outside of US $1295 with a minimum of 16 attendees. This is a 2 day course. |
| Design for Reliability with a minimum of 12 attendees. Outside of US $1440 with a minimum of 14 attendees. This is a 2 day course. |
| Design for Reliability, Reliability Testing and Statistical Analysis, and Failure Analysis of Lead Free Solder Joints with a minimum of 12 attendees. Outside of US $745 with a minimum of 12 attendees. |
| Design for 6 Sigma (1 day Version) with a minimum of 12 attendees. Outside of US $645 with a minimum of 14 attendees. |
| Design for 6 Sigma (2 day Version) with a minimum of 12 attendees. Outside of US $1240 with a minimum of 14 attendees. This is a 2 day course. |
| Design for Testability with a minimum of 12 attendees. Outside of US $645 with a minimum of 14 attendees. |
| Design for Testability for Product and Test Engineers with a minimum of 12 attendees. |
| Design of Experiments (DOE) for Semiconductor Manufacturing and Development with a minimum of 16 attendees. Outside of US $545 with a minimum of 20 attendees. |
| Digital Semiconductor Test Technology with a minimum of 12 attendees. This is a 5 day course. |
| Electronic Component and System Reliability Analysis with a minimum of 12 attendees. Outside of US $1240 per person with a minimum of 15 attendees. This is a 2 day course. |
| Electronics for Non - EE's with a minimum of 14 attendees. Outside of US $690 with a minimum of 16 attendees. |
| Electronics Troubleshooting with a minimum of 12 attendees. Outside of US $1645 with a minimum of 14 attendees. This is a 3 day course. |
| Enabling Technologies for 3D IC Integration and WLP with a minimum of 12 attendees. Outside of US $745 with a minimum of 12 attendees. This is a 3 day course. |
| Equipment Reliability and Productivity Assessment Standards with a minimum of 15 attendees. Outside of US $985 with a minimum of 15 attendees. This is a 2 day course. |
| Extreme Data Rates and Equalization with a minimum of 12 attendees. Outside of US $695 with a minimum of 14 attendees. |
| Fundamentals of 3G Wireless Technologies with a minimum of 12 attendees. Outside of US $1245 with a minimum of 14 attendees. This is a 2 day course. |
| Fundamentals of Chemical Vapor Deposition (CVD) with a minimum of 16 attendees. Outside of US $545 with a minimum of 20 attendees. |
| Fundamentals of Climatic Testing with a minimum of 14 attendees. Outside of US $1245 with a minimum of 14 attendees. This is a 2 day course. |
| Fundamentals of Ion Implantation and RTP with a minimum of 16 attendees. Outside of US $545 with a minimum of 20 attendees. |
| Fundamentals of MEMS Design & Fabrication with a minimum of 20 attendees. Outside of US $645 per person with a minimum of 20 attendees. |
| Fundamentals of Metallization with a minimum of 16 attendees. Outside of US $545 with a minimum of 20 attendees. |
| Fundamentals of Photolithography with a minimum of 16 attendees. Outside of US $545 with a minimum of 20 attendees. |
| Fundamentals of Semiconductor Optoelectronics and Photonics with a minimum of 16 attendees. Outside of US $1145 with a minimum of 16 attendees. This is a 2 day course. |
| Fundamentals of Thermal Processes / Diffusion with a minimum of 16 attendees. Outside of US $545 with a minimum of 20 attendees. |
| Fundamentals of Wafer Cleaning with a minimum of 12 attendees. Outside of US $1045 per person with a minimum of 16 attendees. This is a 2 day course. |
| Gas Delivery for Semiconductor Processing with a minimum of 12 attendees. Outside of US $545 per person with a minimum of 15 attendees. |
| High - k Dielectrics for DRAM, Flash Memory Logic and Ananlog Applications with a minimum of 12 attendees. Outside of US $845 with a minimum of 16 attendees. |
| High Performance Thermal Management Materials for Electronics with a minimum of 12 attendees. Outside of US $1195 with a minimum of 14 attendees. This is a 2 day course. |
| IC Development Cycle with a minimum of 12 attendees. Outside of US $1145 with a minimum of 14 attendees. This is a 2 day course. |
| Intermediate Lithography with a minimum of 16 attendees. Outside of US $695 with a minimum of 20 attendees. |
| Introduction to Atomic Layer Deposition with a minimum of 16 attendees. Outside of US $895 per person with a minimum of 16 attendees. This is a 2 day course. |
| Introduction to Basic Electronics and Devices for the Layperson with a minimum of 16 attendees. Outside of US $545 with a minimum of 20 attendees. |
| Introduction to Chemical Mechanical Planarization / CMP with a minimum of 16 attendees. Outside of US $545 with a minimum of 20 attendees. |
| Introduction to Chip and Wire Assembly in Microelectronic Packaging with a minimum of 20 attendees. Outside of US $695 with a minimum of 20 attendees. |
| Introduction to CMOS Layout with a minimum of 20 attendees. Outside of US $945 with a minimum of 20 attendees. This is a 2 day course. |
| Introduction to CMOS Logic Design with a minimum of 16 attendees. Outside of US $545 with a minimum of 20 attendees. |
| Introduction to Digital Signal Processing with a minimum of 12 attendees. Outside of US $1145 with a minimum of 14 attendees. This is a 2 day course. |
| Introduction to IC Design and Fabrication with a minimum of 20 attendees. Outside of US $545 with a minimum of 20 attendees. |
| Introduction to Integrated Circuit Packaging and Assembly with a minimum of 20 attendees. Outside of US $695 with a minimum of 20 attendees. |
| Introduction to Photovoltaic Technology with a minimum of 14 attendees. Outside of US $595 with a minimum of 16 attendees. |
| Introduction to Integrated Yield Management Fabless Version with a minimum of 20 attendees. Outside of US $1045 with a minimum of 20 attendees. This is a 2 day course. |
| Introduction to Reliability of Physical Design of IC Packaging with a minimum of 12 attendees. Outside of US $645 per person with a minimum of 14 attendees. |
| Introduction to Yield Management Fab Version with a minimum of 20 attendees. Outside of US $1045 with a minimum of 25 attendees. This is a 2 day course. |
| Lead-Free Wafer Level Packaging (WLP) for 3D SiP (System in Packages) and Printed Circuit Board Assemblies with a minimum of 12 attendees. Outside of US $745 with a minimum of 12 attendees. |
| Lean Manufacturing Implementation with a minimum of 14 attendees. Outside of US $1095 with a minimum of 14 attendees. This is a 2 day course. |
| Mastering Fiber Optic Technology with a minimum of 12 attendees. Outside of US $695 with a minimum of 14 attendees. |
| Mastering High Speed Serial Data Technology with a minimum of 12 attendees. Outside of US $695 with a minimum of 14 attendees. |
| MOSFET Device Physics, Performance and Processes with a minimum of 12 attendees. Outside of US $1145 with a minimum of 16 attendees. This is a 2 day course. |
| Overview of Semiconductor Device and Assembly Manufacturing with a minimum of 16 attendees. Outside of US $1295 per person with a minimum of 16 attendees. This is a 2 day course. |
| Photolithography Process Control $695 for this one day course. |
| Photomask Manufacturing and Technology Basics with a minimum of 16 attendees. Outside of US $745 with a minimum of 20 attendees. |
| Project Managers Toolkit for Semiconductor Professionals with a minimum of 14 attendees. Outside of US $1945 with a minimum of 14 attendees. This is a 3 day course. Can also be offered as a 2 days |
| Process Modeling at the Wafer, Chip, Feature and Grain Scales with a minimum of 12 attendees. Outside of US $1250 per person with a minimum of 12 attendees. This is a 2 day course. |
| Reliability Tools and Integration for Overall Reliability Programs with a minimum of 12 attendees. Outside of US $1240 with a minimum of 14 attendees. This is a 2 day course. |
| RF / Microwave Hybrids: Basics, Materials and Processes with a minimum of 12 attendees. Outside of US $800 with a minimum of 12 attendees. |
| RF Wireless Fundamentals with a minimum of 20 attendees. Outside of US $1045 with a minimum of 20 attendees. This is a 2 day course. |
| Root Cause and Corrective Action (RCCA) with a minimum of 12 attendees. Outside of US $1045 with a minimum of 14 attendees. |
| SEMI Standards - EDA Interface - A Standards Overview with a minimum of 15 attendees. Outside of US $985 with a minimum of 15 attendees. This is a 1.5 day course. |
| Semiconductor Cleanroom Management with a minimum of 12 attendees. This is a 2 day course. |
| Semiconductor Memories 101 with a minimum of 14 attendees. Outside of US $695 with a minimum of 16 attendees. |
| Software Reliability with a minimum of 12 attendees. Outside of US $645 with a minimum of 14 attendees. |
| SOI Devices, Technology and Applications with a minimum of 12 attendees. Outside of US $845 with a minimum of 16 attendees. |
| Statistical Process Control (SPC) with a minimum of 16 attendees. Outside of US $545 with a minimum of 20 attendees. |
| Strained - Silicon Devices, Technology and Applications with a minimum of 12 attendees. Outside of US $845 with a minimum of 16 attendees. |
| Testing RF Wireless Fundamentals with a minimum of 12 attendees. Not Available Outside of US |
| Ultra Thin Process, High - k Dielectrics with a minimum of 12 attendees. Outside of US $845 with a minimum of 16 attendees. |
| Understanding Error Analysis and Jitter with a minimum of 12 attendees. Outside of US $695 with a minimum of 14 attendees. |
| Understanding Fiber Optic Communication with a minimum of 12 attendees. Outside of US $695 with a minimum of 14 attendees. |
| Understanding Semiconductor Technology and Business with a minimum of 16 attendees. Outside of US $545 with a minimum of 16 attendees. |
| Understanding Solar PV Business with a minimum of 14 attendees. Outside of US $595 per person with a minimum of 16 attendees. |
| Vacuum System Operation and Diagnostics for Semiconductor Process with a minimum of 12 attendees. Outside of US $1645 with a minimum of 14 attendees. This is a 3 day course. |
| Verilog Design with a minimum of 12 attendees. Outside of US $945 with a minimum of 14 attendees. This is a 2 day course. |
| X-Ray Photoelectron Spectroscopy (XPS/ESCA) with a minimum of 12 attendees. Outside of US $1045 with a minimum of 14 attendees. This is a 2 day course. |
| Most courses require the following items. You Provide: Classroom VCR or DVD Player TV Monitor LCD or Overhead Projector Screen Flipchart or White Board Lunch (optional) |
| Availability: |
| For more information regarding in-house programs, please use the email address provided and contact HEATHER WILSON: |
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| Phone: (636) 343-1333 Fax: (636) 343-1467 |
or write to us at: Pinnacle Training International Seminars, Inc. 1749 Gilsinn Lane, Suite 250 Fenton, Missouri 63026 |