In recent years, the demands for high frequency systems and products have been growing at a rapid pace. Coupled with
the continuing development of monolithic integrated circuits (MMICs), is the emergence of new materials and process refinement of the packaging.
As a result, system and product designers are faced with the choice between hybrids and MMICs; i.e., complete system on a chip vs.
hybrids with discrete devices, or more often, somewhere in-between.
This course will begin with a short, non-mathematical review of high frequency basics. Next a comparison of MMICs and hybrids is presented.
The transmission line as the basic circuit component of RF and microwave hybrids will be reviewed. Hybrid "waveguide" structures will be compared as
they relate to transmission line properties. The basic materials (conductors, dielectrics and substrates) and their properties will be introduced. Their effect
on impedance, circuit properties and performance will be discussed. Processing technologies suitable for RF/microwave hybrids will be reviewed.
Selected packaging protocols, such as vias and bonding wires, will be discussed in light of their influence on RF/microwave performance.
At the completion of this course, attendees will have a better understanding of many of the critical materials and processing factors affecting high frequency
circuit performance.
WHAT THE COURSE COVERS: |
|
Basic Concepts Planer Wave Guides Current Flow and Loss Considerations Substrates Thick Film Thin Film |
Polymers Processing Strategies Photolithography Electroplating Etching Components Packaging |
WHO SHOULD ATTEND? |
|
|
|
|