The explosive growth of high-density SMT packaging has had a major impact on companies that design and
manufacture electronic equipment. As market pressures make it necessary for designers to pack more features into smaller volumes, they strongly influence choices
of IC package style, PCB design, material selection and manufacturing processes. This course was designed to explain SMT design and manufacturing, principles
while confronting the technical and economic issues that accompany the choice of a design/packaging approach such as:
Can I assemble and test high-density SMT assemblies with my current manufacturing equipment? Are my soldering process capabilities compatible with the requirements
of these new SMT device packages? What happens to in-line PC board inspection if the solder joints aren't visually accessible? How can I maintain adequate
control of my product performance and quality if I use the services of a contract manufacturer?
The step-by-step instructional approach integrates videotapes and show-and-tell samples that explain major facets of SMT manufacturing from board fabrication
through assembly line processes. Throughout the workshop attendees will have exposure to "real world" case studies in SMT implementation drawn
from the instructor's experience. Open discussion periods are scheduled where your specific SMT questions can be addressed.
WHAT THE COURSE COVERS: |
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Issues of PCB Design and Layout for High-Density Pinout Configurations Conventional Packages Integrated Circuit Trends Emerging Packages: BGAs Future Packaging Directions Student Participation: Board Fabrication and Printing |
What type, accuracy, paste release and aperture considerations for advanced packaging components?
Component Attachment and Robotic Assembly Soldering Soldering Considerations for Fine Pitch and Ultra Small Solder Bricks Cleaning Cleaning Issues of Advanced Packages Quality, Vision and Repair |
WHO SHOULD ATTEND? |
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