Tracks 101: Microlilthography Coat and Develop Basics

This course provides attendees with a basic working knowledge of microlithography coat and develop or "track" processes. “Track” is the industry jargon for the equipment used to deposit photoresist and subsequently develop the image after the substrate has been exposed. The course provides insight on process, equipment setup, and troubleshooting, focusing mainly on the hardware and the hardware’s impact on the process results. Many practical and useful examples are included throughout. You will become fluent with "track" parameters for many varied applications.


We offer this and all courses as On Site Training


WHAT THE COURSE COVERS:
  • Describe the various aspects of the "track" hardware
  • Describe the various "track" processes
  • Perform basic setup and troubleshoot the HMDS Prime process
  • Perform basic setup and troubleshoot the Coat process
  • Perform basic setup and troubleshoot the develop process
  • Perform basic troubleshooting of hot and cold plates


WHO SHOULD ATTEND?
  • Lithography Engineers with little to no track experience
  • Managers and Non-Lithography Engineers to gain a working knowledge of the "track" hardware and processes

This is a one day course and each student will get a comprehensive set of course notes.


INSTRUCTORS:

Joseph Daggett is a Technical Account Manager for a major chemical company. He received his Bachelor of Science degree in Electrical Engineering from the University of Texas at Dallas and has been in the semiconductor industry since 1980. His "track" experience includes product and applications engineering at Machine Technology, Inc., a member of Sematech's Advanced Track Group, and applications engineering and Applications Laboratory Manager for FSI.

Dan Williams is currently the Eastern Regional Manager for a major chemical company. He received his Bachelor of Science degree in Photographic Science in Instruentation from Rochester Institute of Technology and has worked in lithography since 1982. In his career he has held R&D positions in both the materials and equipment segments of lithography. Prior to his current position, he was the Chief Technologist for FSI International in the Microlithography Division.


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