- Introduction
- Terminology
- Surfaces
- Types of Surfaces
- The Principles of XPS
- Production of Photoelectrons
- Peak Labeling
- Electronic Figuration of Atoms
- Atoms
- Molecules
- Solids
- Energy
- Spectra
- Auger Process
- Valence Spectra
- Surface Sensitivity
- Information Depth
- Sample Handling
- Spin-Orbit Splitting
- Chemical Shift
- Plasmons
- Multiplet Splitting
- Shake-up
- Instrumentation
- Dual Anode
- Bremsstrahlung
- Monochromatic Source
- Electron Energy Analyzers
- Spectrum Acquisition
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- Energy Resolution
- Scattering in Analyzers
- Electron Detectors
- Pulse Counting
- Position Sensitive Detectors
- Small Area Analysis
- Area Location
- Imaging XPS
- Methods
- Equipment and Examples
- Vacuum System Samples
- Energy Scale Calibration
- Qualitative Analysis
- Identification of Elements
- Changing X-Ray sources
- Charging
- Interpretation of Chemical Shift
- Relaxation Effects
- Auger Parameter
- Peak Widths
- Lineshapes
- Quantitative Analysis
- Sensitivity Factors
- Ionization Cross Section
- Asymmetry Parameter
- Analyzer Transmission
- Reference Spectra
- Intensities
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Background Subtraction
Detection Limit
Effect of Thin Overlayers
Artifacts
X-Ray Damage
Charging
Methods for Charge Control
Ghost Peaks
Data Acquisition and Processing
Processing Data
Tougaard Background Subtraction
Satellite Subtraction
Peak Area
Lineshapes
Curve Fitting
Deconvolution
Depth Profiling
Non-Destructive and Destructive Methods
Angle Resolved XPS
Diffraction
Elastic Scattering
Thickogram
Inelastic Loss Method
Sputtering
Depth Calibration
Applications
Instrument Selection and Summary
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