Advanced Topics in Lithography
This course teaches methods to extend optical lithography to the 45 nm technology
node using Image Process Integration (IPI). IPI is the science of choosing
the proper combination of masks (including optical proximity correction),
exposure tool, illuminator design, and photoresist to provide focus-exposure
process windows large enough to use in a manufacturing environment. To maximize
return on investment, the design of the photoresist and the exposure tool
is used to simplify reticle design as much as possible. Simulation and experiment
are combined to form predictions of production resolution, and recommendations
are given to make these predictions a reality.
|
WHAT THE COURSE COVERS:
Introduction to Image Process Integration (IPI)
Image Process Integration Components
- Exposure Tool
- Imaging Overview
- Off-Axis Illumination
- Layout and Design
- Mask
- Phase-Shifting Masks
- Optical Proximity Correction (OPC)
- Alternating PSMs
- Resist Process
- Chemistry Overview
- Resist Modeling
- Optimizing Thickness and Reflection
- Hot Plates as Exposure Tools
- Develop Process Considerations
Image Process Integration Examples
- Improving Process Window for Dense and Isolated Lines
- Optimizing Contact Holes
- Attacking Aberrations
- Reducing Mask Error Enhancement Factor (MEEF)
Image Process Integration Conclusions
|
WHO SHOULD ATTEND?
- R&M Technicians
- Experienced Process Technicians
- Equipment Engineers
- CVD dielectric films: properties and application
- Process Operators
- Engineering
- Other professionals who would like an explanation of Advanced Lithography
|
Materials included in this class include Advanced Lithography course notes.
"We Exceed Your Expectations!"
Return to Home Page
Return to Course Schedule