This course teaches methods to extend optical lithography to the 45 nm technology node using Image Process Integration (IPI). IPI is the science of choosing the proper combination of masks (including optical proximity correction), exposure tool, illuminator design, and photoresist to provide focus-exposure process windows large enough to use in a manufacturing environment. To maximize return on investment, the design of the photoresist and the exposure tool is used to simplify reticle design as much as possible. Simulation and experiment are combined to form predictions of production resolution, and recommendations are given to make these predictions a reality.
WHAT THE COURSE COVERS:
Image Process Integration Components |
WHO SHOULD ATTEND?
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INSTRUCTOR: |
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John Petersen has been doing advanced semiconductor imaging since 1980 and is
recognized as an industry leader in the field of optical lithography. John was a Fellow at International Sematech where he led project DELPHI. DELPHI provided
an assessment for using advanced optical techniques for 150 nm and smaller imaging in production John has also been fundamental in the development of advanced chemically amplified
resist models that combine reaction and diffusion rate models into a single entity and microlithography imaging process in both production and research environments.
Working first at Texas Instruments, then later at Shipley, he spent over thirteen years starting a number of various applications, product testing, and field service and product
development groups in the United States and in Japan. He was involved in deep UV resists lithography testing and process development; he left Shipley and joined International
SEMATECH. John holds a Bachelor of Science Degree in Chemistry from Adams State College. He did his graduate work in physical inorganic
chemistry at Texas Tech University. An internationally acclaimed leader in the field of microlithography, John has published more than forty papers
and taught classes for both SEMI and SPIE.
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