Quick Ramp™ is a HIGH LEVEL OVERVIEW OF BEST PRATICES to reduce cycle times
and improve semiconductor yield ramps. Included are course modules:
NPI Pro [feasibility / development / manufacturing];
Structure Pro [design / critical structures / entitled yield];
Sync Flo [cycle time / queueing/ wip];
Defect Pro [limited yield concept / macro models];
Analysis Pro [root cause analysis: zones / product sensitivity];
Process Pro [operations / recipes / monitors / particles / pattern defects];
Meeting Pro [project management / communication];
Pro Act [problem solving teams]
NPI Pro explores the pitfalls of
New Product and Technology Introductions. Includes problems encountered when moving
from research to development to high yield manufacturing. Basic principles to minimize the pitfalls are described.
Structure Pro.
Learn how Test Structures speed the yield ramp. Before the design is committed to silicon,
we will predict entitled yield, identify yield limiting design features and enable definition of tradeoffs
between design and manufacturing. To maximize output, we characterize the process for yield limiting
factors and look at the design layout options and interpret the results of Test structures.
Sync Pro explores how
Synchronized Manufacturing, integrates product moves and yield learning. What stops output?
Learn about the queuing elements, maximizing capacity, controlling WIP flow rates [arrivals],
optimizing WIP flow routes [processing rates], and the integration of TAKT and range management.
Defect Pro explores
Fault Concepts for design / parametrics / random defects; micro models & die windowing for systematic vs random yield;
clustering; defect distributions; fail probability; and the critical area concept to scale yield between designs & to predict
yields before any silicon processing. In depth
Defect Models explores yield by die size / feature size / circuits / shrinks / new generation. Advanced analysis & scaling techniques and
Modeling Product Yield in a foundry are explored. Class “homework” completes this module.
Analysis Pro explores the many types of
Systematic Faults using analytical techniques for design, parameter & test limited yield,
including techniques of design schmoos, wafer zones, wafer patterns, process windows, time slides,
product / parameter sensitivities [correlations / distributions], and equipment commonality.
Calculations of design / parametric / test limited yield are included.
Process Pro explores the key fab management control elements
for output: operations control [supplies & moves],
recipe control [equipment & process],
monitor control [parameters],
particle control [particles],
pattern defect control [defects & ADI [scan, analyze, classify, review defect histograms by type/size, killer probability, calculate limited yield].
Meeting Pro describes how to implement and manage the numerous actions,
metrics and controls into Project Management Output Meetings. Output Ownership requires strong design, fab operations and
product management team roles. We will provide a framework for these roles.
Pro Act focuses on
Problem Solving techniques through ownership teams, hypothesizing the problem and using a methodical approach
to build time-lined action plans for fixing the problem & establishing preventive measures.
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