Advanced Wet etching & cleaning

This one-day course provides a working knowledge of surface conditioning and cleaning techniques used in the manufacture of integrated circuits. Fundamentals of the techniques used for cleaning the wafer surface will be discussed. Practical applications and methods for cleaning will be presented. Upon completing this course participants will have an understanding of all types of cleaning processes used in IC manufacturing; surface conditioning for pre-diffusion clean, in particular pre-gate oxide clean, post-etch and post-implant photoresist removal, particle removal, post-CMP clean. Participants will be able to understand the cleaning roadmaps and limitations of clean technologies as the node sizes decrease. The course participant should be able to make informed decisions on the surface conditioning and cleaning processes and techniques to utilize for IC manufacturing.

What the Course Covers:

• Provide a basic knowledge of various surface conditioning and cleaning technologies used in the manufacture of integrated circuits
• Provides an overview of the processes and equipment used for wet, plasma, and dry cleaning. Plus discusses the chemistries used for these cleaning steps.
• Provides an overview and allows comparison of established surface conditioning and cleaning techniques and new technologies.
• In addition, this course will introduce new technologies such as supercritical fluid processing and cryoaerosol processing that may be used for future clean requirement.
• Provides information on specific surface conditioning techniques including critical cleaning, photoresist stripping, and post-CMP cleaning.
• Plus discusses techniques such as megasonics, dilute chemistries, and the use of ozone.
• Provides an understanding of how the cleans affects low-k dielectrics and copper.
• Plus cleaning challenges for new materials.