All airfare and associated travel costs are paid for by Pinnacle Training International Seminars. All courses are one (1) day unless otherwise stated. |
| Advanced High Speed Digital
Design and PCB Layout
with a minimum of 12 attendees. Outside of US $1895 with a minimum of 14 attendees. This is a 3 day course. |
| Advanced Copper Interconnect Technology
with a minimum of 16 attendees. Outside of US $1045 with a minimum of 16 attendees. This is a 2 day course. |
| Advanced
Etch and Cleaning
with a minimum of 16 attendees. Outside of US $595 with a minimum of 20 attendees. |
| Advanced
Lithography
with a minimum of 18 attendees. Outside of US $695 with a minimum of 20 attendees. |
| Applied Data Analysis
with a minimum of 12 attendees. Outside of US $1045 with a minimum of 14 attendees. This is a 2 day course. |
| Auger Electron Spectroscopy (AES)
with a minimum of 12 attendees. Outside of US $1045 with a minimum of 14 attendees. This is a 2 day course. |
| Biomimetics - Biologically Inspired Technology
with a minimum of 20 attendees. |
| Bypassing (Including BGA's) Crosstalk and
Differential Signaling
with a minimum of 12 attendees. Outside of US $1345 with a minimum of 12 attendees. This is a 2 day course. |
| CMOS Analog Design
with a minimum of 14 attendees. Outside of US $1545 with a minimum of 16 attendees. This is a 3 day course. |
| CMOS Latchup Design and Process Solutions
with a minimum of 12 attendees. Outside of US $1395 with a minimum of 12 attendees. This is a 2 day course. |
| Complete Overview of Electrostatic Discharge
with a minimum of 16 attendees. Outside of US $545 with a minimum of 20 attendees. |
| Defect Isolation of Microelectronic
Die
with a minimum of 15 attendees. Outside of US $695 per person with a minimum of 20 attendees. |
| Defect Isolation of Microelectronic
Packaging
with a minimum of 15 attendees. Outside of US $695 per person with a minimum of 20 attendees. |
| Design for Reliability
with a minimum of 12 attendees. Outside of US $1440 with a minimum of 14 attendees. This is a 2 day course. |
| Design for 6 Sigma (1 day Version)
with a minimum of 12 attendees. Outside of US $645 with a minimum of 14 attendees. |
| Design for 6 Sigma (2 day Version)
with a minimum of 12 attendees. Outside of US $1240 with a minimum of 14 attendees. This is a 2 day course. |
| Design for Testability
with a minimum of 12 attendees. Outside of US $645 with a minimum of 14 attendees. |
| Design of Experiments (DOE) for Semiconductor
Manufacturing and Development
with a minimum of 16 attendees. Outside of US $545 with a minimum of 20 attendees. |
| Electronic Component and System Reliability Analysis
with a minimum of 12 attendees. Outside of US $1240 per person with a minimum of 15 attendees. This is a 2 day course. |
| Electronics for Non - EE's
with a minimum of 14 attendees. Outside of US $690 with a minimum of 16 attendees. |
| Electronics Troubleshooting
with a minimum of 12 attendees. Outside of US $1645 with a minimum of 14 attendees. This is a 3 day course. |
| Electrostatic Discharge (ESD)for RF Design with a minimum of 12 attendees. Outside of US $1345 with a minimum of 14 attendees. This is a 2 day course. |
| Equipment Reliability and Productivity
Assessment Standards
with a minimum of 15 attendees. Outside of US $985 with a minimum of 15 attendees. This is a 2 day course. |
| Essentials of Digital Technology
with a minimum of 12 attendees. Outside of US $1245 with a minimum of 14 attendees. This is a 2 day course. |
| Extreme Data Rates and
Equalization
with a minimum of 12 attendees. Outside of US $695 with a minimum of 14 attendees. |
| Failure Mechanisms in Semiconductor Devices
with a minimum of 12 attendees. Outside of US $1145 with a minimum of 14 attendees. This is a 2 day course. |
| Fundamental
RF Plasma Generation for Semiconductor Processing Equipment
with a minimum of 20 attendees. This is a 2 day course. |
| Fundamentals of 3G Wireless Technologies with a minimum of 12 attendees. Outside of US $1245 with a minimum of 14 attendees. This is a 2 day course. |
| Fundamentals
of Chemical Mechanical Planarization / CMP
with a minimum of 16 attendees. Outside of US $545 with a minimum of 20 attendees. |
| Fundamentals
of Chemical Vapor Deposition (CVD)
with a minimum of 16 attendees. Outside of US $545 with a minimum of 20 attendees. |
| Fundamentals of Climatic Testing
with a minimum of 14 attendees. Outside of US $1245 with a minimum of 14 attendees. This is a 2 day course. |
| Fundamentals
of Ion Implantation and RTP
with a minimum of 16 attendees. Outside of US $545 with a minimum of 20 attendees. |
| Fundamentals
of MEMS Design & Fabrication
with a minimum of 20 attendees. Outside of US $645 per person with a minimum of 20 attendees. |
| Fundamentals
of Metallization
with a minimum of 16 attendees. Outside of US $545 with a minimum of 20 attendees. |
| Fundamentals
of Photolithography
with a minimum of 16 attendees. Outside of US $545 with a minimum of 20 attendees. |
| Fundamentals
of Semiconductor Optoelectronics and Photonics
with a minimum of 16 attendees. Outside of US $1145 with a minimum of 16 attendees. This is a 2 day course. |
| Fundamentals
of Thermal Processes / Diffusion
with a minimum of 16 attendees. Outside of US $545 with a minimum of 20 attendees. |
| Fundamentals of Wafer Cleaning
with a minimum of 12 attendees. Outside of US $1045 per person with a minimum of 16 attendees. This is a 2 day course. |
| Gas Delivery for Semiconductor Processing
with a minimum of 12 attendees. Outside of US $545 per person with a minimum of 15 attendees. |
| High Speed Clock Control, Terminations, Vias, and
Transmission Lines
with a minimum of 12 attendees. Outside of US $1345 with a minimum of 14 attendees. This is a 2 day course. |
| IC Development Cycle
with a minimum of 12 attendees. Outside of US $1145 with a minimum of 14 attendees. This is a 2 day course. |
| Intermediate Lithography
with a minimum of 16 attendees. Outside of US $695 with a minimum of 20 attendees. |
| Introduction to Atomic Layer Deposition
with a minimum of 16 attendees. Outside of US $895 per person with a minimum of 16 attendees. This is a 2 day course. |
| Introduction to
Basic Electronics and Devices for the Layperson
with a minimum of 16 attendees. Outside of US $545 with a minimum of 20 attendees. |
| Introduction to Chip and Wire Assembly in
Microelectronic Packaging
with a minimum of 20 attendees. Outside of US $695 with a minimum of 20 attendees. |
| Introduction to CMOS Layout with a minimum of 20 attendees. Outside of US $945 with a minimum of 20 attendees. This is a 2 day course. |
| Introduction
to CMOS Logic Design
with a minimum of 16 attendees. Outside of US $545 with a minimum of 20 attendees. |
| Introduction to Digital Signal Processing
with a minimum of 12 attendees. Outside of US $1145 with a minimum of 14 attendees. This is a 2 day course. |
| Introduction to
IC Design and Fabrication
with a minimum of 20 attendees. Outside of US $545 with a minimum of 20 attendees. |
| Introduction to
Integrated Circuit Packaging and Assembly
with a minimum of 20 attendees. Outside of US $695 with a minimum of 20 attendees. |
| Introduction to
Integrated Yield Management Fabless Version with a minimum of 20 attendees. Outside of US $1045 with a minimum of 20 attendees. This is a 2 day course. |
| Introduction to Reliability of Physical Design of IC Packaging
with a minimum of 12 attendees. Outside of US $645 per person with a minimum of 14 attendees. |
| Introduction to Yield Management
Fab Version
with a minimum of 20 attendees. Outside of US $1045 with a minimum of 25 attendees. This is a 2 day course. |
| Inventing and Patenting: How to Become an Inventor and Write Patents with a minimum of 12 attendees. Outside of US $795 with a minimum of 12 attendees. |
| Key Issues of EMI / EMC
with a minimum of 12 attendees. Outside of US $1445 with a minimum of 14 attendees. This is a 2 day course. |
| Lead Free Solder Impacts of EU RoHS and
China RoHS on IC Packaging and PCB Assembly
with a minimum of 20 attendees. Outside of US $695 per person with a minimum of 20 attendees. |
| Low-Cost Flip Chip, WLCSP Lead Free
Technologies
with a minimum of 20 attendees. Outside of US $695 per person with a minimum of 20 attendees. |
| Mastering Fiber Optic
Technology
with a minimum of 12 attendees. Outside of US $695 with a minimum of 14 attendees. |
| Mastering High Speed Serial
Data Technology
with a minimum of 12 attendees. Outside of US $695 with a minimum of 14 attendees. |
| MOSFET Device Physics, Performance and Processes
with a minimum of 12 attendees. Outside of US $1145 with a minimum of 16 attendees. This is a 2 day course. |
| Overview of Semiconductor Device and Assembly Manufacturing
with a minimum of 16 attendees. Outside of US $1545 per person with a minimum of 16 attendees. This is a 2 day course. |
| Photolithography Process Control
$695 for this one day course. |
| Photomask Manufacturing and Technology Basics
with a minimum of 16 attendees. Outside of US $745 with a minimum of 20 attendees. |
| Physics of Failure of III-V Microelectronic Devices
with a minimum of 12 attendees. Outside of US $745 with a minimum of 14 attendees. |
| Plasma Etching and RIE: Fundamentals and Applications
with a minimum of 12 attendees. Outside of US $1045 with a minimum of 14 attendees. This is a 2 day course. |
| Project Managers Toolkit for Semiconductor Professionals
with a minimum of 14 attendees. Outside of US $1945 with a minimum of 14 attendees. This is a 3 day course. Can also be offered as a 2 days |
| Process Modeling at the Wafer, Chip, Feature and
Grain Scales
with a minimum of 12 attendees. Outside of US $1250 per person with a minimum of 12 attendees. This is a 2 day course. |
| Reliability Tools and Integration for Overall
Reliability Programs
with a minimum of 12 attendees. Outside of US $1240 with a minimum of 14 attendees. This is a 2 day course. |
| RF / Microwave Hybrids: Basics, Materials and Processes
with a minimum of 20 attendees. Outside of US $800 with a minimum of 12 attendees. |
| RF Wireless Fundamentals
with a minimum of 20 attendees. Outside of US $1045 with a minimum of 20 attendees. This is a 2 day course. |
| Root Cause and Corrective Action (RCCA)
with a minimum of 12 attendees. Outside of US $1045 with a minimum of 14 attendees. |
| SEMI Standards - EDA Interface - A Standards
Overview
with a minimum of 15 attendees. Outside of US $985 with a minimum of 15 attendees. This is a 1.5 day course. |
| Semiconductor Cleanroom Management
with a minimum of 12 attendees. This is a 2 day course. |
| Signal Integrity in High
Speed Digital Design & PCB Layout
with a minimum of 12 attendees. Outside of US $1945 with a minimum of 14 attendees. This is a 3 day course. |
| Software Reliability
with a minimum of 12 attendees. Outside of US $645 with a minimum of 14 attendees. |
| SOI Devices, Technology and Applications
with a minimum of 12 attendees. Outside of US $845 with a minimum of 16 attendees. |
| Statistical Process Control (SPC)
with a minimum of 16 attendees. Outside of US $545 with a minimum of 20 attendees. |
| Strained - Silicon Devices, Technology and Applications
with a minimum of 12 attendees. Outside of US $845 with a minimum of 16 attendees. |
| Surface Mount Technology (SMT)
PCBs Manufacturing
with a minimum of 12 attendees. Outside of US $1895 with a minimum of 14 attendees. This is a 3 day course. |
| Testing Surface Mount Technology (SMT)
PCBs
with a minimum of 12 attendees. Outside of US $1895 with a minimum of 14 attendees. This is a 3 day course. |
| Tracks 101: Microlithography Coat and Develop Basics
with a minimum of 16 attendees. Outside of US $545 with a minimum of 20 attendees. |
| Ultra Thin Process, High - k Dielectrics
with a minimum of 12 attendees. Outside of US $845 with a minimum of 16 attendees. |
| Understanding Error Analysis
and Jitter
with a minimum of 12 attendees. Outside of US $695 with a minimum of 14 attendees. |
| Understanding Fiber
Optic Communication
with a minimum of 12 attendees. Outside of US $695 with a minimum of 14 attendees. |
| Understanding Semiconductor Technology and Business
with a minimum of 16 attendees. Outside of US $545 with a minimum of 16 attendees. |
| Vacuum System Operation and Diagnostics for Semiconductor Process
with a minimum of 12 attendees. Outside of US $1645 with a minimum of 14 attendees. This is a 3 day course. |
| Verilog Design
with a minimum of 12 attendees. Outside of US $945 with a minimum of 14 attendees. This is a 2 day course. |
| Wafer Level Reliability
with a minimum of 12 attendees. Outside of US $1145 with a minimum of 16 attendees. This is a 2 day course. |
| X-Ray Photoelectron Spectroscopy (XPS/ESCA)
with a minimum of 12 attendees. Outside of US $1045 with a minimum of 14 attendees. This is a 2 day course. |
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Most courses require the following items. You Provide: Classroom
VCR or DVD Player
TV Monitor
LCD or Overhead Projector Screen
Flipchart or White Board
Lunch (optional)
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Availability:
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For more information regarding in-house programs, please use the email address provided and contact HEATHER WILSON: |
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Phone: (636) 343-1333 Fax: (636) 343-1467 |
or write to us at: Pinnacle Training International Seminars, Inc. 1749 Gilsinn Lane, Suite 250 Fenton, Missouri 63026 |