This 2 day tutorial will provide an overview of copper interconnect technology. We will review the basic materials and processes used in Cu interconnect including dielectric materials, TSV, patterning, metallization, CMP, packaging, and reliability.
What the Course Covers:
Who Should Attend:
Anyone wanting an understanding of copper processing
Next Schedule Date and Location:
Only offer at clients' site
$12,900 USD for 14 students)
Contact us if interested in an on site training program