PT International, LLCSemiconductor Training


Copper Layers


Advanced Copper Interconnect technology          (2 day)

This 2 day tutorial will provide an overview of copper interconnect technology. We will review the basic materials and processes used in Cu interconnect including dielectric materials, TSV, patterning, metallization, CMP, packaging, and reliability.

What the Course Covers:

  • Introduction Scaling
  • RC Delay
  • Power
  • Dielectric Material Processing
  • What is Dielectric Constant?
  • Types of Dielectrics; Organic vs Inorganic
  • Deposition: Plasma CVD vs Spin-on
  • Barrier Layers: SiN, SiC
  • Dielectric Material Properties
  • Electrical Properties
  • Mechanical Properties
  • Thermal Properties
  • Thermal and Chemical Stability
  • Process Integration of Copper Interconnects
  • Integration Options
  • Lithography and RIE
  • Resist Strip and Cleans
  • Metal Deposition: Liner and Seed, Plating
  • Packaging; Wirebond vs. Flipchip
  • CMP
  • TSV
  • Reliability of Cu Interconnects
  • Electromigration
  • Stress Migration
  • TDDB Package
  • Stress Evaluation; pull test, shear test, humidity test, thermal cycle



Who Should Attend:

Anyone wanting an understanding of copper processing


Next Schedule Date and Location:

Only offer at clients' site


 $12,900 USD for 14 students)

Contact us if interested in an on site training program