Wet Processing in the Semiconductor Industry

This one-day course provides a working knowledge of surface conditioning and cleaning techniques used in the manufacture of integrated circuits. Fundamentals of the techniques used for cleaning the wafer surface will be discussed. Practical applications and methods for cleaning will be presented. This course is intended for anyone involved in wet etch or cleaning the wafer processing of semiconductor devices, such as process engineers, process techs, R&M techs, or tool vendors. 

Upon completing this course participants will have an understanding of all types of cleaning processes used in IC manufacturing; surface conditioning for pre-diffusion clean, in particular pre-gate oxide clean, post-etch and post-implant photoresist removal, particle removal, post-CMP clean. Participants will be able to understand the cleaning roadmaps and limitations of clean technologies as the node sizes decrease. The course participant should be able to make informed decisions on the surface conditioning and cleaning processes and techniques to utilize for IC manufacturing.

Course Topics: surface conditioning and cleaning technologies, processes and equipment, wet, plasma, and dry cleaning, surface conditioning and cleaning techniques, cleaning technologies, effects, and challenges.

Learning Objectives:

Describe basic knowledge of various surface conditioning and cleaning technologies used in the manufacture of integrated circuits.
Summarize an overview of the processes and equipment used for wet, plasma, and dry cleaning.
Discuss the chemistry used for the cleaning steps.
Compare the established surface conditioning and cleaning techniques.
Review new technologies and specific techniques.
Describe how the cleaning affects low-k dielectrics and copper.
Identify cleaning challenges for new materials.