Failure Analysis & Prevention of Semiconductor Tools Due to Corrosion (1 day)

When semiconductor tools fail it is important to determine the root cause of the problem.. A key source of particles is the result of corrosion processes in semiconductor equipment and gas delivery lines.
In particular halogens, chlorine, bromine and fluorine. These particles fall on the dies and become embedded in the developing structure. Corrosion issues can occur in semiconductor tools such as etch, deposition, CMP, loadlocks, ,robotics, transfer chambers, process chambers, gas panels, gas delivery lines and process cooling water systems.

Students will learn about various forms of corrosion and prevention such as:

• General Corrosion
  
• Pitting Corrosion
  
• Stress Corrosion Cracking
  
• Galvanic Corrosion
  
• Intergranular Corrosion
  

What the Course Covers:

1. ·Corrosion Testing
   ​Advanced Coating Evaluation: Immersion testing of advanced coatings in acid enviroments to determine coating integrity and resistance to corrosion.
   
   Vendor Quality Evaluation: Evaluation of tool vendors to determine quality of electro-polishing and passivation process.
   
   
   Students will learn:
   TECHNIQUES USED IN FAILURE ANAlYSIS
   Stereoscopic Microscope Examination Techniques
   Dye Penetrant Testing
   Radiographic Examination Techniques
   Optical Microscopy
   Scanning Electron Microscopy and EDS Analysis
   Auger and XPS Surface Analysis
   ​Optical Emission Spectroscopy for Chemical Analysis
   

Tool Designers, Equipment Engineers R&M ,technicians, and students who would like a detailed understanding of corrosion issues in semiconductor tools