When semiconductor tools fail it is important to determine the root cause of the problem.. A key source of particles is the result of corrosion processes in semiconductor equipment and gas delivery lines.
In particular halogens, chlorine, bromine and fluorine. These particles fall on the dies and become embedded in the developing structure. Corrosion issues can occur in semiconductor tools such as etch, deposition, CMP, loadlocks, ,robotics, transfer chambers, process chambers, gas panels, gas delivery lines and process cooling water systems.
Students will learn about various forms of corrosion and prevention such as:
What the Course Covers:
Advanced Coating Evaluation: Immersion testing of advanced coatings in acid enviroments to determine coating integrity and resistance to corrosion.
Vendor Quality Evaluation: Evaluation of tool vendors to determine quality of electro-polishing and passivation process.
Students will learn:
TECHNIQUES USED IN FAILURE ANAlYSIS
Stereoscopic Microscope Examination Techniques
Dye Penetrant Testing
Radiographic Examination Techniques
Scanning Electron Microscopy and EDS Analysis
Auger and XPS Surface Analysis
Optical Emission Spectroscopy for Chemical Analysis
Who Should Attend:
Tool Designers, Equipment Engineers R&M ,technicians, and students who would like a detailed understanding of corrosion issues in semiconductor tools
Next Schedule Date and Location:
Only offer at clients site
Price: $9,800 USD for up to 14 students