This 1 day course  addresses IC packaging, assembly, and package/substrate interconnections. It stresses the impact of the IC and end product requirements, i.e., “smaller, better, cheaper” their influence on the manufacturing processes.  Topics include area packaging - ball grid arrays and chip scale packages, and the assembly technologies – Chip & Wire, Tape Automated Bonding, and Flip Chip. High Density Interconnect substrate manufacturing technologies including HDI Printed wiring boards are also discussed, as is emerging technologies namely, 3-D and  stacked die, and packages and packaging reliability issues.

Any one wanting to understand assembly and packaging of ICs