This 1 day course addresses IC packaging, assembly, and package/substrate interconnections. It stresses the impact of the IC and end product requirements, i.e., “smaller, better, cheaper” their influence on the manufacturing processes. Topics include area packaging - ball grid arrays and chip scale packages, and the assembly technologies – Chip & Wire, Tape Automated Bonding, and Flip Chip. High Density Interconnect substrate manufacturing technologies including HDI Printed wiring boards are also discussed, as is emerging technologies namely, 3-D and stacked die, and packages and packaging reliability issues.
Who Should Attend:
Any one wanting to understand assembly and packaging of ICs
Next Schedule Date and Location:
Only offer at clients site
Price: $8,900 USD for up to 14 students