What the Course Covers:

:During this course the student will learn advanced semiconductor process characterization, control, and yield methods applicable across the design, process, yield and test spectrum. This cross-functional approach integrates roles and responsibilities, which are vital for new product introduction and maximum fab output. Topics include product life cycles, new product introduction, test structures, synchronized manufacturing, managing defects, root cause analysis, process control, problem solving for fab operations and project management, and how test structures speed the yield ramp. Before the design is committed to silicon, the student will predict entitled yield, identify yield limiting design features and enable definition of tradeoffs between design and manufacturing. To maximize output, the student will characterize the process for yield limiting factors, look at the design layout options, and interpret the results of test structures, micro models, recipe control, and pattern defect control. The student will learn how to implement and manage numerous actions, metrics and controls into project management output meetings.