To stay current in this constant changing industry, a deep understanding is required of the new methods of semiconductor manufacturing. After completing this course, the student will have a complete understanding of current semiconductor manufacturing processes. The course covers device operation, crystal growth and various types of substrates such as Si, SiGe, FDSOI, GaAs. Discuss various types of transistors such as pMOS, nMOS, Bipolar, BiCMOS, CMOS and FinFets. How circuit design impacts fabrication, mask making, wafer processing, assembly, packaging and final test are also covered. Additional topics include wafer processing steps such as mask generation, lithography, (including EUV), Deposition (CVD, electro-plating, ALD, ALE, sputtering, oxidation, diffusion, implant, RTP, etching, TSV and wafer probe.
What the Course Covers:
Who Should Attend:
Any one wanting an understanding of semiconductor manufacturing
Next Schedule Dates , Locations and Webinars:
January 28-29, 2021/ Webinar for USA Attendees (Starts at 9:30am CST, Central Time in USA)( $995 USD)
Will be using ZOOM platform
February 22-23, 2021/ Webinar for Asian Attendees (Starts at 9:30am CST Taiwan Time)
( $995 USD)
Will be using ZOOM platform
March 2-3, 2021/ Webinar for European Attendees (Starts at 9am Munich, Germany time)
($995 USD)
Will be using ZOOM platform
Price: $995 USD per person (10% discount if 3 or more students attend the same event from the same company) All Webinars are $995 USD per person
Also can be conducted at your company site for $12,900 USD for up to 20 students
To Register: Click here