OVERVIEW of semiconductor manufacturing

Semiconductor Manufacturing Overview Outline:

Introduction:

The purpose of the course is to provide a comprehensive understanding of the semiconductor industry and the manufacturing process of an integrated circuit for new personnel entering the field or individuals looking for a well-rounded understanding of all the jargon, tools, and materials used in the process.

What the course covers:

Basic Electronics and Microelectronics Terms:

Definition of basic electronic terms and concepts
Overview of microelectronics and the role of integrated circuits

Define Process Nodes:

Explanation of process nodes and how they relate to device performance and cost

Device Physics and Transistor Operation:

Understanding of the physical principles behind device operation and the functioning of transistors

Crystal Growth and Wafer Prep:

Overview of crystal growth techniques used in semiconductor manufacturing
Explanation of wafer preparation techniques and materials used

FDSOI, Fin Fets, Gate all around (GAA) Transistors:

Explanation of these advanced transistor technologies and their impact on device performance

Circuit Design and Layout:

Overview of circuit design and layout techniques and tools used in semiconductor manufacturing

Mask Making:

Explanation of mask making techniques and materials used in lithography

Clean Rooms:

Overview of clean room environments and their importance in semiconductor manufacturing

Lithographic Techniques: DUV, Immersion, EUV

Explanation of various lithographic techniques used in semiconductor manufacturing

Plasma and Wet Etch:

Overview of plasma and wet etch and cleaning processes used in semiconductor manufacturing

Ion Implantation:

Explanation of ion implantation techniques and their role in device fabrication

Diffusion:

Overview of diffusion techniques used in semiconductor manufacturing

RTP, CVD, ALD, ALE:

Explanation of these advanced manufacturing techniques and their impact on device performance

Electro-Plating, Sputtering, CMP:

Overview of electro-plating, sputtering, and chemical mechanical polishing techniques used in semiconductor manufacturing

Wafer Sort, Wire Bonding, Bumping:

Explanation of wafer sorting, wire bonding, and bumping techniques and their role in device packaging

Packaging Technology 3D Stacking, TSV, Wafer Level Packaging (WLP):

Overview of 3D stacking, through-silicon-via, and wafer level packaging technologies used in semiconductor manufacturing

Advantages of the Course:

Improved understanding of semiconductor manufacturing and its processes
Improved ability to understand and navigate the complex terminology and technologies used in the industry
Increased familiarity with the tools and materials used in semiconductor manufacturing

Conclusion:

This course provides a comprehensive overview of the semiconductor industry and the manufacturing process of an integrated circuit, helping new personnel entering the field or individuals seeking a better understanding of the industry to navigate the complex technologies and terminology used in the field.