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PTInternational LLCSemiconductor Training

OVERVIEW of semiconductor manufacturing


Semiconductor Manufacturing Overview Outline:

Introduction
The purpose of the course is to provide a comprehensive understanding of the semiconductor industry and the manufacturing process of an integrated circuit for new personnel entering the field or individuals looking for a well-rounded understanding of all the jargon, tools, and materials used in the process.


What the course covers:

Basic Electronics and Microelectronics Terms:

Definition of basic electronic terms and concepts
Overview of microelectronics and the role of integrated circuits

Define Process Nodes :

Explanation of process nodes and how they relate to device performance and cost

Device Physics and Transistor Operation

Understanding of the physical principles behind device operation and the functioning of transistors

Crystal Growth and Wafer Prep:Overview of crystal growth techniques used in semiconductor manufacturing
Explanation of wafer preparation techniques and materials used

FDSOI, Fin Fets, Gate all around (GAA) Transistors:

Explanation of these advanced transistor technologies and their impact on device performance

Circuit Design and Layout
:

Overview of circuit design and layout techniques and tools used in semiconductor manufacturing Mask Making:

Explanation of mask making techniques and materials used in lithography

Clean Rooms: Overview of clean room environments and their importance in semiconductor manufactu ring Lithographic Techniques: DUV, Immersion, EUV Explanation of various lithographic techniques used in semiconductor manufacturing Plasma and Wet Etch:


Overview of plasma and wet etch and cleaning processes used in semiconductor manufacturing Ion Implantation:Explanation of ion implantation techniques and their role in device fabrication

Overview of diffusion techniques used in semiconductor manufacturing RTP, CVD, ALD, ALE techniques and their impact on device performance


Electro-Plating, Sputtering,


Testing


Wire bonding


Packaging techniques such as stacking
die, Flip chip and, ChipLets

Metrology tools and applications

Who are the major players in the semiconductor ecosystem



Who Should Attend:

Any one wanting  an understanding of semiconductor manufacturing.


Next Schedule Dates , Locations for Webinars and Seminars
 April 4-5, 2024/ Webinar for European Attendees ( Starts at 9:30am Munich, Germany time ($995 USD)
Will be using ZOOM platform

April 10-11, 2024/Webinar for American Attendees ( Starts at 9:30am central time ($995 USD)
Will be using ZOOM platform


In Person Seminars Dates and locations:


Portland, OR /March 25-26, 2024/ $1295 USD


Phoenix, AZ/ April 16-17, 2024/ $1295 USD


Price:$995 USD per person for webinar and $1295 for seminars (10% discount if 3 or more students attend the same event from the same company.

We can conduct at your company site for $13,900 USD for up to 20 students  (additional charges for applied for attendees over the first 20 of $395 USD)



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