PT  International, LLC  Semiconductor Training

high performance thermal management for electronic components

This 2 day course provides various new advanced composite materials are now available, which provide great advantages over conventional materials for electronic packaging thermal control, including:

  • Extremely high thermal conductivities (up to twice that of copper)
  • Low, tailorable coefficients of thermal expansion
  • Extremely high strength and stiffness
  • Low densities
  • Low cost, net shape fabrication processes
  • These characteristics provide the following benefits in packaging components:

  • Significantly improved thermal performance
  • Weight savings up to 80%
  • Size reductions up to 65%
  • Significant thermal stress reductions
  • Design simplification
  • Cost savings


Who Should Attend:

Any one interested in thermal management of electronic components


    Next Schedule Date and Location:

    Only offer at clients' site


    $12,900 USD for up to 14 students

    Contact us if interested in an on site training program