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PT  International, LLC  Semiconductor Training

Flip Chip packaging ( 2 days)

This 2 day course provides an overview of Flip Chip Packaging.

Topics:


​History of Flip Chip


  • Advantages of Flip Chip and comparison to alternative packaging options
  • Types of Flip Chip and their advantages & disadvantages


  • Solder bump
  • Copper pillar bump
  • Gold bump
  • Stud bump & other


Bonding mechanisms and resulting joints

  • Solder reflow (mass)
  • Solder reflow (thermode)
  • Thermocompression
  • TCNCP (Thermo-Compression, Non-Conductive Paste)
  • Conductive paste
  • Bond hierarchy in multi-chip packages
  • Other


Substrates for Flip Chip bonding

  • Ceramic
  • Laminate
  • Leadframe
  • Bond pad designs
  • SMD
  • NSMD
  • Plated up
  • Other


Design rules for Flip Chip


Chip

  • I/O cell placement vs packaging requirements
  • Substrate / package
  • Cost implications
  • DFT
  • DFR


Manufacturing – process, materials, equipment

  • Wafer prep including RDL
  • Bumping process including UBM
  • Evaporation, sputtering, plating, photolithography…
  • Flip Chip assembly & process flow
  • Underfill – including capillary, no-flow and other
  • Equipment
  • OSAT Flip Chip options
  • Flip Chip Quality Control


Process control
Inspection
Equipment and metrology

Flip Chip Reliability

  • TCE mismatch and DNP
  • Role of underfill
  • Reliability tests (T/C, drop, bend, high temperature bias, other)
  • Electromigration of solder vs. copper pillar bump


Flip Chip thermal enhancement

  • Modeling


Flip Chip electrical performance

  • Versus wirebonding
  • High speed issues
  • Modeling


Flip Chip Application Examples

  • High End / High Speed
  • High Leadcount
  • Mobile
  • Analog / RF
  • Flip Chip on chip
  • Other


Flip Chip-Like Application Examples

  • Stacked chip TSV microbumps
  • TAB
  • Display drivers
  • 2.5D / interposers / EMIB


Flip Chip versus other packaging options

  • Wirebond leadframe packaging
  • Wirebond laminate packaging
  • FOWLP / FOPLP
  • SiP

 

 

Who Should Attend:

Any one interested in flip chip technology


     

    Next Schedule Date and Location:

    Only offer at clients' site

    Price:

    $13,900 USD for up to 14 students

    Contact us if interested in an on site training program