Failure Analysis & Root Cause Engineering

Course Overview

This course teaches engineers how to systematically identify, analyze, and resolve semiconductor device failures. Using electrical, physical, and chemical analysis techniques, participants will gain practical skills to perform root cause investigations and implement corrective actions. Hands-on examples illustrate common fab failures and defect characterization.

Learning Objectives

Who Should Attend

Failure analysis engineers, reliability engineers, yield engineers, process engineers, QA engineers, and R&D personnel.

Prerequisites

Foundational knowledge of semiconductor device physics and fabrication processes.