PTI technical training
Failure Analysis & Root Cause Engineering
Explore failure analysis and root cause methods for semiconductor applications. Review PTI's course outline and discuss focused training for your team.
Course Overview
This course teaches engineers how to systematically identify, analyze, and resolve semiconductor device failures. Using electrical, physical, and chemical analysis techniques, participants will gain practical skills to perform root cause investigations and implement corrective actions. Hands-on examples illustrate common fab failures and defect characterization.
Learning Objectives
- Understand the failure analysis workflow and methodologies
- Learn techniques for electrical, material, and structural analysis (FIB, SEM/TEM, EDX)
- Develop skills for delayering and cross-sectional analysis
- Identify common failure modes in advanced node devices
- Implement corrective actions to prevent recurring failures and improve yield
Who Should Attend
Failure analysis engineers, reliability engineers, yield engineers, process engineers, QA engineers, and R&D personnel.
Prerequisites
Foundational knowledge of semiconductor device physics and fabrication processes.