Semiconductor Training Courses

2-day design course covering Standard Cell, Gate Arrays, FPGAs, DFT methods, and testing procedures.

Comprehensive course covering IC packaging, assembly, interconnections, ball grid arrays, flip chip, fanout, stacking die, chip scale packages, and emerging 3D technologies.

3-day course on digital test tech covering ATE systems, DC/AC/functional testing, and design-for-testability.

Comprehensive course covering plasma assisted phenomena, reactive ion etching (RIE) processes, ALE methods, and plasma diagnostics for semiconductor manufacturing.

Introductory course covering MEMS fabrication techniques, applications, photolithography, etching, deposition, metrology, and packaging. No prior knowledge required.

Comprehensive introduction covering design, fabrication, business models, and industry overview.

Comprehensive overview of manufacturing from wafer fabrication to final testing, including clean room operations.

Master systematic approaches to troubleshooting, covering diagnostics, tools, and problem-solving.

Overview of EUV lithography, covering system architecture, mask tech, and process integration for advanced nodes.

Introduction to memory technologies including DRAM, SRAM, Flash, and emerging types. Covers architecture and operation.

Fundamentals of CMOS logic design covering transistor operation, logic gates, timing analysis, and power optimization.

2-day Verilog HDL training covering SystemVerilog, data types, simulation, synthesis, and FPGA/ASIC development.

Advanced course on copper interconnects, covering damascene processes, barrier layers, CMP, and reliability challenges.

Comprehensive course covering wet etch & clean, electroplating, and CMP processes for IC manufacturing. Includes surface conditioning and cleaning techniques.

Deep sub-micron CMOS integration covering advanced lithography, etching, deposition, and integration challenges.

2-day training covering ion implantation fundamentals, equipment, process control, and troubleshooting.

Explore principles of semiconductor optoelectronics, photonic devices, and their applications in modern technology.

Complete overview of integrated circuit design and fabrication processes from concept to production.

Learn the fundamentals of IC packaging technologies, assembly processes, and reliability considerations.

Professional training in introduction to statistical process control (SPC) for semiconductor industry professionals.

1-day training on MFCs, covering gas flow control, calibration, maintenance, and best practices for gas delivery.

1-day course on intellectual property fundamentals including trademarks, copyrights, trade secrets, and patents.

Understand PFAS chemicals in semiconductor processes, regulations, health impacts, and alternative solutions.

1-day course on RF plasma fundamentals and how plasma parameters influence etch, CVD, and PVD processes.

Training in RF measurement instrumentation including network analyzers, Z’scan RF sensors, and Picoscopes.

Advanced concepts in RF power delivery for plasma systems, including generators and matching networks.

Course on sustainability, health hazards, and strategies for reclaiming resources in semiconductor manufacturing.

1-day course for developing and debugging fiber optic components and networks, including DWDM systems.

Practical knowledge of vacuum systems operation, diagnostics, pumps, gauges, RGA, and leak detection.

Advanced surface analysis techniques using XPS for materials characterization and failure analysis.

Comprehensive yield management strategies and statistical analysis for manufacturing optimization.

Training covering 3D stacking, TSV (Through Silicon Via), and TGV technologies for advanced packaging.

Training on reliability practices, failure analysis, Weibull analysis, and FMEA for manufacturing equipment.

3-day training covering Design of Experiments (DOE) for process optimization and characterization.

1-day course covering fan-out packaging definition, advantages, chip first vs chip last, and other advanced tech.

2-day training on flip chip technology, including solder bumping, copper pillar, and underfill processes.

1-day training on CMP fundamentals, polishing equipment, consumables (slurries/pads), and process control.

2-day CMOS layout course covering topological processes, floor planning, transistor techniques, and IC dev flow.

3-day training covering VLSI device physics, scaling effects, hot-carrier degradation, DIBL, and characterization.

3-day course on mixed-signal and analog testing, covering test economics, defect-oriented testing, and signal generation.

Strategies for equipment suppliers to drive high reliability, minimize preventive maintenance, and increase profit.

Comprehensive course covering electronics fundamentals, troubleshooting techniques, testing equipment, and hands-on circuit building for semiconductor professionals.

Comprehensive course covering Atomic Layer Deposition (ALD), Atomic Layer Etching (ALE), and precursor chemistries for semiconductor manufacturing.

CMOS digital logic concepts at an intuitive level, ideal for professionals who interact with, manage, or support ASIC and FPGA designers.

IC packaging, assembly, and interconnections covering BGA, CSP, chip & wire, TAB, flip chip, HDI substrates, and 3D packaging technologies.

SPC course covering control charts, process capability, quality management, Cp/Cpk calculations, and statistical methods for semiconductor manufacturing.

Verilog HDL training covering hardware description languages, SystemVerilog, data types, design simulation, synthesis, and FPGA/ASIC development.

MFC training covering gas flow control, calibration, maintenance, installation, and best practices for precise semiconductor process gas delivery.

Memory design course covering SRAM, DRAM, Flash, array architecture, peripheral circuits, testing, power management, and memory technologies.

Fiber optics communications training covering optical principles, fiber types, connectors, testing methods, and network applications.