PTI technical training
Overview of Semiconductor Manufacturing
Build an overview of IC manufacturing, from device physics and wafer preparation to processing. Explore PTI's introductory semiconductor training course.
Course Overview
The purpose of this course is to provide a comprehensive understanding of the semiconductor industry and the manufacturing process of an integrated circuit for new personnel entering the field or individuals looking for a well-rounded understanding of all the jargon, tools, and materials used in the process.
What the Course Covers
Basic Electronics and Microelectronics
- Definition of basic electronic terms and concepts
- Overview of microelectronics and the role of integrated circuits
- Process nodes and their relation to device performance and cost
Device Physics and Transistor Technologies
- Device physics and transistor operation
- Understanding physical principles behind device operation
- FDSOI, FinFets, Gate All Around (GAA) Transistors
- Advanced transistor technologies and their impact on performance
Crystal Growth and Wafer Preparation
- Overview of crystal growth techniques
- Wafer preparation techniques and materials
- Silicon substrate specifications and quality
Circuit Design and Layout
- Circuit design and layout techniques
- Tools used in semiconductor manufacturing
- Mask making techniques and materials used in lithography
Wafer Processing and Clean Rooms
- Clean room environments and their importance
- Contamination control and safety protocols
- Wafer handling and processing procedures
Lithographic Techniques
- DUV (Deep Ultraviolet) lithography
- Immersion lithography
- EUV (Extreme Ultraviolet) lithography
- Pattern transfer and resolution enhancement
Etching and Processing
- Plasma and wet etch processes
- Cleaning processes and contamination removal
- Ion implantation techniques and device fabrication
- Diffusion techniques
Deposition and Advanced Processes
- RTP (Rapid Thermal Processing)
- CVD (Chemical Vapor Deposition)
- ALD (Atomic Layer Deposition)
- ALE (Atomic Layer Etching) techniques
- Electroplating and sputtering
Testing, Assembly, and Packaging
- Testing methodologies and quality control
- Wire bonding techniques
- Packaging techniques: stacking die, flip chip, chiplets
- WLP (Wafer Level Packaging)
- Metrology tools and applications
Industry Ecosystem
- Major players in the semiconductor ecosystem
- Supply chain and market dynamics
- Industry trends and future outlook
Who Should Attend
Anyone wanting an understanding of semiconductor manufacturing, including new personnel entering the field or individuals looking for a well-rounded understanding of all the jargon, tools, and materials used in the process.
What Past Attendees Are Saying
"Most important course and most needed at Intel!"
- Michael Fors, Intel Learning Manager
"I have known Denny for over 25 years... He has an in-depth firsthand as well as academic knowledge of the subject, most of all his teaching/training style is most engaging and very easy to follow regardless of your own background knowledge."
- Azmat Siddiqi, Quality Director at Applied Materials