Mixed Signal & RF Testing

Course Overview

Participants learn basic but powerful aspects about mixed-signal semiconductor and electronics testing. This 3 day skill-building series is divided into four segments:

• Test Phases and Economics: Fundamentals of characterization and diagnosis, assumptions behind wafer sort and final production test, test hardware development time, and test time and accuracy.
• Direct and Indirect Testing: Fundamentals of analog and specification measurements, techniques for test time reduction, alternate test techniques, and tests based on current signatures.
• Defect-Oriented Test: Fault models, inductive fault analysis, fault simulation, and test generation based on these concepts.
• On-Chip/On-Board Signal Generation: Using sigma-delta modulators, mixers and passive components to generate and sense signals on-board or on-chip; implementation and cost-benefit analysis.

Course Objectives

• Gain in-depth understanding of mixed-signal semiconductor testing and technical issues.
• Understand test economics, yield, test time, and cost of test.
• Identify key issues for developing mixed-signal test programs.
• Discuss specific test problems with an expert instructor.
• Recognize principles for defect-oriented test and IEEE 1149.4 mixed-signal boundary scan.
• Introduction to fundamental and advanced concepts of RF testing.

Who Should Attend

Test, Product and Applications Engineers, Engineering Managers and Sales Engineers; also valuable for Design, Verification, and DFT Engineers.