PTI technical reference · Kindle, paperback & hardcover

Semiconductor Manufacturing for the AI Era

Understand the manufacturing behind AI chips.

Connect device physics, wafer fabrication, advanced packaging and fab operations in one 29-chapter semiconductor manufacturing reference.

View book on Amazon

Available in Kindle, paperback and hardcover.
See Amazon for format options, current pricing and availability.

Semiconductor Manufacturing for the AI Era — book cover featuring Denny Frye
Semiconductor Manufacturing for the AI Era
PT International LLC

Reader perspectives

What readers say about the book.

Comments on Semiconductor Manufacturing for the AI Era from semiconductor industry leaders.

“Semiconductor Manufacturing for the AI Era is fantastic reference text. I had an opportunity to review the book and had trouble putting it down. In fact, my son also looked through it and was equally impressed. This is an outstanding resource for anyone seeking a deeper understanding of semiconductor technology and manufacturing.”

Thomas CaulfieldExecutive Chairman, GlobalFoundries

“So far, I have reviewed the first two chapters and I am completely impressed. I intend to review the entire book, well done.”

Joe StockunasPresident, SEMI Americas

“Your book is incredibly well written!! And the graphics are great!!!

It's a simple to understand compilation of what it took me 50 years to learn. And now it brings me up to date!!”

Walden (Wally) RhinesCEO, Silvaco

“Excellent text book. Unique source for teaching and understanding the Semiconductor Manufacturing Processes in one place. You guys did a great job and created a powerful tool.”

Dave CrivelliCEO, Crivelli, Whiteside & Associates.

From device to system

See how the manufacturing steps connect.

A technical reference for semiconductor professionals, advanced students and educators looking beyond a high-level industry overview.

Devices & wafer fabrication

Follow transistor architectures, materials and process steps—from crystal growth and doping to thin films, CVD and ALD.

Lithography, etch & interconnects

Connect EUV and High-NA lithography with atomic-scale etching, CMP, metallization and interconnect technology.

Memory, packaging & fab operations

Explore HBM, 3D NAND, hybrid bonding and chiplets alongside yield management, testing, safety and maintenance.

Table of contents

29 chapters. The full manufacturing flow.

Review the chapter list to see how the book fits your work, studies or training program.

Parts I & II · Foundation & Infrastructure7 chapters
  • Ch 1: The Semiconductor Industry in the AI Era
  • Ch 2: Semiconductor Device Physics for Nanoscale Nodes
  • Ch 3: Advanced Transistor Architectures
  • Ch 4: Fab Architecture and Cleanroom Design
  • Ch 5: Contamination Control and Cleaning Technology
  • Ch 6: Gases, Liquid Chemicals, and Ultra-Pure Water
  • Ch 7: Vacuum Technology for ULSI Applications
Parts III & IV · Wafer & FEOL Processing8 chapters
  • Ch 8: Silicon Single-Crystal Growth
  • Ch 9: Wafer Manufacturing & Specialty Substrates
  • Ch 10: Thermal Processing and Diffusion
  • Ch 11: Ion Implantation and Doping
  • Ch 12: Oxidation and High-k Dielectrics
  • Ch 13: Plasmas Used in Microchip Manufacturing
  • Ch 14: Thin-Film Fundamentals and CVD/ALD
  • Ch 15: Epitaxy and Advanced Silicon Structures
Parts V & VI · Lithography, Etch & BEOL7 chapters
  • Ch 16: Lithography I: Photoresist Materials
  • Ch 17: Lithography II: Image Formation & Optics
  • Ch 18: Lithography III: EUV & High-NA Mask Tech
  • Ch 19: Wet Etching and Dry Atomic-Scale Etching (ALE)
  • Ch 20: Chemical Mechanical Polishing (CMP)
  • Ch 21: PVD and Angstrom-Era Metallization
  • Ch 22: Interconnect Technology and Air Gaps
Parts VII & VIII · Packaging, Test & Operations7 chapters
  • Ch 23: Semiconductor Memory (HBM & 3D NAND)
  • Ch 24: Advanced Packaging (Hybrid Bonding & Chiplets)
  • Ch 25: Materials Characterization and Electrical Test
  • Ch 26: TCAD and Process Simulation
  • Ch 27: Wafer Fab Operations and Yield Management
  • Ch 28: Environmental, Health, Safety & Sustainability
  • Ch 29: Fab Maintenance & Troubleshooting Case Studies

Inside the book

Preview the illustrations.

Selected illustrations from the book. Open an image to view it at full size in a new tab.

Denny Frye, PT International founder and semiconductor educator

Meet Denny Frye

A teacher’s perspective
on manufacturing.

Semiconductor Manufacturing for the AI Era brings PT International’s technical training perspective to a semiconductor reference.

PTI founder. Semiconductor educator.

Denny Frye brings a practical training perspective to the processes and technologies covered in the book.

Meet Denny and PT International

Teaching experience

Feedback on Denny’s seminars.

These comments concern Denny’s teaching, not reviews of this book.

"Denny presented a wonderful semiconductor seminar! He should create a textbook with his knowledge and expertise!"

Dr. Jeffery BuckDean & VP of School of Business, Purdue University

"He does an excellent job of making complex ideas easy to understand."

Andy AhrendtVP of National Manufacturing, Clean Rooms

"He has an in-depth firsthand as well as academic knowledge of the subject, most of all his teaching/training style is most engaging and very easy to follow regardless of your own background knowledge."

Azmat SiddiqiQuality Director, Applied Materials

Your semiconductor reference

Keep the manufacturing flow within reach.

Choose Kindle, paperback or hardcover on Amazon. Check the listing for current pricing and availability.

View book on Amazon