PTI technical training
Fan Out Packaging
Explore fan-out packaging technology and its role in semiconductor assembly. Review PTI's technical course outline and ask about training availability.
Course Outline
Definition and Advantages
What is Fan-Out Packaging?
- Chip First vs. Chip Last
- Die Up vs. Die Down
- Fan-Out vs. Embedded Die
Advantages of Fan-Out Packaging
History
- Infineon / Freescale / Others
- Simpler, Single-Chip Fan-Out Packages
- High Volume Production Examples
- Design Process Flow
- Equipment
- Materials
Advanced Fan-Out Packaging
- Multi-chip Package-on-Package (PoP)
- Apple Application Processor in TSMC InFO-PoP Package – deep dive
- Bridge Chips
- Through-mold Interconnects
- Adaptive Patterning
- Wafer vs. Panel Processing
Landscape
- OSAT Providers
- Patents / IP
Summary / Conclusion
Course Content
Key Topics Covered
- Comprehensive coverage of fundamental concepts and principles
- Practical applications and real-world examples
- Industry best practices and current methodologies
- Hands-on exercises and case studies
- Latest developments and emerging trends
- Problem-solving techniques and troubleshooting
Who Should Attend
Engineers, technicians, and professionals in the semiconductor industry who need comprehensive training in this specialized area. This course is designed for both newcomers and experienced professionals seeking to enhance their knowledge and skills.
Prerequisites
Basic understanding of semiconductor principles and manufacturing processes is recommended. Specific prerequisites may vary depending on the course complexity.