3D stacking and TSV

Course Overview

After more than a decade the industry continues to recognize the power of the third dimension in package and sub-system assembly for the implementation of highly integrated electronic products. 3D ass...

Course Content

Who Should Attend

Engineers, technicians, and professionals in the semiconductor industry who need comprehensive training in this specialized area. This course is designed for both newcomers and experienced professionals seeking to enhance their knowledge and skills.

Prerequisites

Basic understanding of semiconductor principles and manufacturing processes is recommended. Specific prerequisites may vary depending on the course complexity.