PTI technical training
Fundamentals of Chemical Mechanical Planarization (CMP)
Study chemical mechanical planarization fundamentals for semiconductor manufacturing. Review PTI's CMP course topics and available training options.
Course Overview
This 1-day course provides a sound foundation in the fundamentals of chemical mechanical planarization (CMP) used in integrated circuit fabrication. Topics include CMP overview, CMP tools, CMP consumables, process control, dielectric CMP, CMP of conducting materials and post CMP cleaning.
Course Topics
CMP Overview
- Generalized schematics of CMP and Post-CMP Clean
- Current CMP environment and evolution
- The CMP Module and Infrastructure
Equipment and Process
- Polishing equipment trends and process issues
- Consumables (pads & slurries)
- Quality issues and productivity factors
- Critical pad and slurry parameters
CMP Applications
- Dielectric CMP applications
- CMP of conducting materials (Copper, Tungsten, Cobalt)
- Post CMP cleaning and defect issues
- Environmental Health and Safety considerations
Who Should Attend
Process engineers, R&M technicians, equipment engineers, product engineers, tool application and sales engineers.