Course Overview
This introductory course is designed to educate people from any background that are new to Microsystems Fabrication and Applications, no prior knowledge is expected. We begin with some historical applications to set the stage for diving into how these devices are made. We will go through the fabrication of a simple sensor and actuator device describing fabrication and characterization methods used in training students and participants new to the field.
Topics Covered
Introduction and Context
- Background and Introduction
- Historical evolution of MEMS from IC technology
- Key industry applications (automotive, biomedical, aerospace, IoT)
- Market trends and microsystems workforce needs
MEMS Devices and Applications
- Overview of common MEMS devices (sensors, actuators, DMD, Inkjet)
- Examples from research and education including CAD designs
Photolithography for MEMS
- Fundamentals of resist processing and alignment
- Resist types and their role in MEMS
- Common photolithography issues and solutions
Etching Techniques
- Wet etching: isotropic and anisotropic (e.g., KOH, HF)
- Dry etching: RIE, DRIE
- Process selectivity, stiction, and release strategies – XeF2, HF Vapor
Thin Film Deposition
- Overview of PVD, CVD, and ALD methods
- Common materials for MEMS (metals, oxides, nitrides)
- Deposition challenges and effects on device performance
Metrology and Characterization
- Techniques: profilometry, SEM, optical inspection
- Measuring film thickness, CD, roughness, and alignment
- Use of metrology in process monitoring and SPC
- Wafer level testing
Learning Objectives
- Identify and describe common MEMS devices, including sensors, actuators, and display technologies like DMD and inkjet systems
- Understand the principles of photolithography
- Compare etching and release techniques (wet vs. dry) and explain their roles in defining microscale features, including release strategies using XeF₂ and HF vapor
- Describe thin film deposition methods
- Use knowledge of metrology tools and techniques to evaluate film thickness, critical dimensions (CD), roughness, and device alignment
- Discuss process monitoring and control using metrology data in the context of statistical process control (SPC)
- Summarize key MEMS packaging strategies, including wafer bonding and die-level considerations
- Appreciate educational and workforce training models, including hands-on cleanroom experience, NSF-funded initiatives, and academic-industry partnerships
Who Should Attend
People from any background that are new to Microsystems Fabrication and Applications. No prior knowledge is expected.