PTI technical training
Advanced Copper Interconnect Technology
Explore copper interconnects, damascene processing, barrier layers, CMP and reliability. Review PTI's technical course and discuss training for your team.
Course Overview
This 2-day tutorial will provide an overview of copper interconnect technology. We will review the basic materials and processes used in Cu interconnect including dielectric materials, TSV, patterning, metallization, CMP, packaging, and reliability.
What the Course Covers
Introduction
- Scaling
- RC Delay
- Power
Dielectric Material Processing
- What is Dielectric Constant?
- Types of Dielectrics; Organic vs Inorganic
- Deposition: Plasma CVD vs Spin-on
- Barrier Layers: SiN, SiC
Dielectric Material Properties
- Electrical Properties
- Mechanical Properties
- Thermal Properties
- Thermal and Chemical Stability
Process Integration of Copper Interconnects
- Integration Options
- Lithography and RIE
- Resist Strip and Cleans
- Metal Deposition: Liner and Seed, Plating
- Packaging; Wirebond vs. Flipchip
- CMP
- TSV
Reliability of Cu Interconnects
- Electromigration
- Stress Migration
- TDDB Package
- Stress Evaluation; pull test, shear test, humidity test, thermal cycle
Who Should Attend
Anyone wanting an understanding of copper processing.