Process Integration & Node Scaling for Advanced Nodes

Professional semiconductor training with 46+ years of industry expertise

Course Overview

This course provides a comprehensive overview of semiconductor process integration across advanced technology nodes. Attendees will learn how front-end-of-line (FEOL), middle-of-line (MOL), and back-end-of-line (BEOL) processes interact and influence device performance. The course emphasizes scaling challenges, process interactions, and defect mitigation strategies.

Learning Objectives

  • Understand the full process flow from wafer start to device completion
  • Analyze interactions between FEOL, MOL, and BEOL processes
  • Identify integration challenges in advanced nodes (7nm → 2nm)
  • Evaluate trade-offs in process sequence, materials, and device architecture
  • Develop strategies to reduce integration defects and improve yield

Who Should Attend

Process engineers, integration engineers, device engineers, R&D engineers, and fab managers involved in advanced node production.

Prerequisites

A foundational understanding of semiconductor manufacturing processes is recommended.

Ready to Register?

$4,000 USD per person
(Enterprise discount: packages available for 3+ attendees)
Register Now
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Duration
3 Days
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Format
On-site Training

Need More Information?

Have questions about this course or need a custom training solution?

Phone: 636-343-1333

Email: heather@pti-inc.com