Definition
Plasma etch rate is the rate at which a material is removed by a plasma etch process, commonly expressed as removed thickness or feature depth per unit time under specified conditions.
Application
Used as a key process metric for throughput and profile control and is tuned with plasma chemistry, power, pressure, temperature, and other etch conditions.
Related concepts
Evidence and further reading
- Evidence from nist.govhttps://www.nist.gov/publications/fabrication-process-optomechanical-transducer-platform-integrated-actuation
- Evidence from plasma.oxinst.comhttps://plasma.oxinst.com/products/icp-etching/