Definition
The amount of material thickness or feature depth removed by an etch process per unit time under specified process conditions, commonly reported in units such as nanometers per minute or micrometers per minute.
Application
Used to set etch time and throughput targets, compare process conditions, control target depth and calculate or interpret selectivity and endpoint behavior for specific material stacks.
Related search terms
Plasma etch rate; material removal rate
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Related concepts
Evidence and further reading
- Evidence from patents.google.comhttps://patents.google.com/patent/KR20050002381A/en
- Evidence from plasma.oxinst.comhttps://plasma.oxinst.com/technologies/icp-rie