Definition
The ratio of etch rates for two materials under the same process conditions, commonly expressed as the target-material etch rate divided by the etch rate of a mask, stop layer or neighboring material.
Application
Used to choose chemistries and operating conditions that remove the intended film while preserving masks, spacers, stop layers or adjacent materials; high selectivity expands integration margin and reduces unwanted erosion or damage.
Related search terms
Etch-rate selectivity; material selectivity
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Related concepts
Evidence and further reading
- Evidence from newsroom.lamresearch.comhttps://newsroom.lamresearch.com/Tech-Brief-All-About-ALE
- Evidence from plasma.oxinst.comhttps://plasma.oxinst.com/technologies/icp-rie