Etch Uniformity

06 Plasma, Etch & Pattern Transfer

Definition

Etch uniformity describes how consistently an etch removes material or produces target dimensions across a wafer, from wafer to wafer, or across a batch; it is commonly evaluated through variation in etch depth, rate, or critical dimension.

Application

Fabs monitor etch uniformity because center-to-edge or wafer-to-wafer variation can shift feature dimensions and reduce process margin and yield; advanced plasma tools actively control spatial etch behavior to improve repeatability.

Related search terms

Etch-rate uniformity; etch depth uniformity

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Related concepts

Evidence and further reading