Definition
The cross-sectional geometry of a feature after etching, including characteristics such as sidewall angle, taper, bowing, necking, bottom shape and depth.
Application
Used to evaluate and control pattern transfer in contacts, trenches, memory holes, MEMS structures and other high-aspect-ratio features because profile deviations can alter critical dimensions, integration margin and device performance.
Related search terms
Etched feature profile; etch sidewall profile; cross-sectional etch profile
Search phrases help you find this entry; their meaning depends on the context shown here.
Related concepts
Evidence and further reading
- Evidence from newsroom.lamresearch.comhttps://newsroom.lamresearch.com/New-Atomic-Layer-Etching-Capability-Enables-Continued-Device-Scaling
- Evidence from lamresearch.comhttps://www.lamresearch.com/product/dsie-product-family/