Definition
A material placed between surfaces to improve heat transfer across their interface.
Application
Used between a power-semiconductor package and a heat sink to fill interface gaps and reduce thermal resistance.
Related concepts
Evidence and further reading
- Evidence from tfaws.nasa.govhttps://tfaws.nasa.gov/wp-content/uploads/TFAWS2015-PT-07.pdf
- Evidence from assets.nexperia.comhttps://assets.nexperia.com/documents/application-note/AN90046.pdf