Packaging, Assembly, Chiplets & 3D Integration
Browse 72 glossary entries in Packaging, Assembly, Chiplets & 3D Integration. Open a term for its definition, application, related concepts and evidence.
72 entries
- 2.5D Integration
- 3D Integration
- Advanced Packaging
- Advanced Packaging Substrate
- Assembly
- Backside Grinding
- Ball Grid Array
- Bond Pad
- Bump
- Bump Pitch
- Bump Plating
- Chiplet
- Coefficient of Thermal Expansion
- Controlled Collapse Chip Connection
- Copper Pillar
- Copper-Copper Bonding
- CoWoS
- Dicing
- Dicing Saw
- Die
- Die Attach
- Die Bonding
- Die-to-Die Interface
- Die-to-Wafer Bonding
- Direct Bond Interconnect
- Direct Bonding
- Direct Wafer Bonding
- Encapsulation
- Fan-Out Wafer-Level Packaging
- Fine-Pitch Interconnect
- Flip Chip
- Glass Interposer
- Heat Spreader
- Heterogeneous Integration
- Hybrid Bonding
- Intermetallic Compound
- Interposer
- Known Good Die
- Leadframe
- Moisture Sensitivity Level
- Mold Compound
- Multi-Chip Module
- Multi-Die Integration
- Organic Substrate
- Package Reliability
- Package Substrate
- Package-on-Package
- Packaging
- Panel-Level Packaging
- Power Delivery Network
- Quad Flat No-Lead
- RDL Interposer
- Reflow
- Scribe Lane
- Semiconductor Package
- Silicon Interposer
- Solder Bump
- System-in-Package
- Thermal Interface Material
- Thermo-Mechanical Stress
- Through-Glass Via
- Through-Silicon Via
- Transfer Molding
- UCIe
- Under-Bump Metallization
- Underfill
- Wafer Bonding
- Wafer Thinning
- Wafer-Level Packaging
- Wafer-to-Wafer Bonding
- Warpage
- Wire Bonding
Continue learning with PTI
Related PTI training covers the following parts of this topic. See each course outline for its scope.
- Advanced Packaging Including Heterogeneous Integration & Chiplets
Package and die interconnect structures including BGA, flip chip, stacked dies and 3D integration.