Definition
An integration process in which singulated dies are aligned and permanently bonded to a target wafer, either individually or through a collective die-transfer flow.
Application
Used for heterogeneous and 3D integration when dies may differ in size, technology or yield; D2W can place known-good dies onto a target wafer and can use fusion or hybrid bonding with stringent cleaning, activation, particle control and overlay requirements.
Related search terms
D2W bonding; chip-to-wafer bonding
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Related concepts
Evidence and further reading
- Evidence from evgroup.comhttps://www.evgroup.com/technologies/die-to-wafer-fusion-and-hybrid-bonding
- Evidence from imec-int.comhttps://www.imec-int.com/en/press/imec-demonstrates-die-wafer-hybrid-bonding-cu-interconnect-pad-pitch-2mm